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Applying Thermal Compounds/Grease

Last response: in Overclocking
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November 5, 2009 5:22:54 PM

Here's a fairly odd question in regards to application of thermal compound:

In my experience, less is more. Meaning--you do better when applying less thermal compound/grease than you do with more. Applying a small "grain of rice" sized amount on the CPU seems to yield better results than attempting to cover the whole CPU.

Has anyone tried using, say, a rubber glove and spread a very thin film on the entire CPU? I generally feel like the edges of the CPU would be rather neglected if only a small amount. I have always tried my best to use a "grain of rice" amount on the CPU and spread it around as evenly as possible to get the best contact.

What do you guys suggest for getting maximum CPU coverage?
November 5, 2009 6:49:41 PM

Thank you, Magic.
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November 5, 2009 11:34:44 PM

In the old days I used to use a razor blade to spread a very thin layer of thermal compound across the cpu. When I switched to a newer thermal compound I followed the manufacturer's directions and just applied a small amount in the center of the cpu. The results were outstanding. Which technique to use depends on the thermal compound and the manufacturer's recommendation.

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November 6, 2009 12:19:22 AM
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How to apply TIM depends on these things:

1. How flat the CPU/HSF is

2. If the cooler is DHT

For non-DHT and lapped HSFs I use my finger covered in cling wrap to smooth the TIM (~2 rice grains) over the CPU.

For DHT coolers: Some notes on applying thermal paste to the Xigmatek S1280(etc) and other DHT coolers

These above methods work well for AS5, ShinEtsu and IC Diamond.
November 6, 2009 10:15:42 AM

Ahh, these are all great--but shadow gave me exactly what I was looking for (running the Xigamtek HDT dark knight!) thank you guys so much.
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