I find the latest rumored speeds of the upcoming AMD cpu (Debeb) intriguing, not just because hopefully AMD may have a new, fast chip coming, but its NOT using HKMG, and the rumors are the chip can go to 4Ghz on air. I can remember as far back as 2006, when certain members here, and some whove left, ascertained the HKMG mantra, at 45 nm and less, youll have to have it, or youre voltage wont be controlled within the chip, and youll have leakage galore.
Well, this seemed to be confirmed, as Intel was humming away with their new 45nm quads and duals, using HKMG, while AMDs 65 quads ate power, abd the old K8 duals did as well. But now, it would seem if the Deneb chip can do this, and from whats also been rumored, and more to fact with Shanghai, the power usage and thermals both look great, showing very low leakage, which goes against everything Ive read and heard about HKMG. I know it helps, but I feel it JUST helps, and has been overhyped, and also used against AMD, IBM etc in various forums and site writeups. Heres a link that shows some interesting info http://www.eetimes.eu/semi/212002481?pgno=3
Quote:" How did AMD reach 45 nm without resorting to HKMG? Actually, the first 45-nm device on the market was Matsushita's UniPhier, and it also used conventional poly plus oxy-nitride dielectric. Just like AMD, Matsushita brought immersion lithography online to meet the scaling requirements of 45 nm. In fact, UniPhier boasts the tightest metal pitches we have seen in a logic chip at 138 nm. The transistor performance requirements of the UniPhier design were lower than a high-performance server processor. The end game for Matsushita was basically circuit density"
So, while Intel certainly does employ nice processes in thier cpu's, they arent the only ones whore innovative, but to me, it seems they ARE the ones that get all the credit, even for things that apparently dont amount to much at 45nm
Well, this seemed to be confirmed, as Intel was humming away with their new 45nm quads and duals, using HKMG, while AMDs 65 quads ate power, abd the old K8 duals did as well. But now, it would seem if the Deneb chip can do this, and from whats also been rumored, and more to fact with Shanghai, the power usage and thermals both look great, showing very low leakage, which goes against everything Ive read and heard about HKMG. I know it helps, but I feel it JUST helps, and has been overhyped, and also used against AMD, IBM etc in various forums and site writeups. Heres a link that shows some interesting info http://www.eetimes.eu/semi/212002481?pgno=3
Quote:" How did AMD reach 45 nm without resorting to HKMG? Actually, the first 45-nm device on the market was Matsushita's UniPhier, and it also used conventional poly plus oxy-nitride dielectric. Just like AMD, Matsushita brought immersion lithography online to meet the scaling requirements of 45 nm. In fact, UniPhier boasts the tightest metal pitches we have seen in a logic chip at 138 nm. The transistor performance requirements of the UniPhier design were lower than a high-performance server processor. The end game for Matsushita was basically circuit density"
So, while Intel certainly does employ nice processes in thier cpu's, they arent the only ones whore innovative, but to me, it seems they ARE the ones that get all the credit, even for things that apparently dont amount to much at 45nm