- Nov 14, 2009
- 60
- 0
- 18,630
Alright, here is my dilemma:
Case: CoolerMaster HAF 932
CPU: Core i7 920, D0 stepping
Mobo: Asus P6T Deluxe V2
RAM: Triple Channel Corsair Dominator 6GB 1600 MHz
PSU: Corsair 850 Watt Modular
I'm using realtemp to get the temps. of my CPU cores, and when my system is idling at stock speeds with the overclocking settings in my BIOS all set to auto with Speed Step and all those other features enabled, I'm sitting at 40 C average about 15 hours into the AS5 curing process. What puzzles me is that when I run Prime95 with these settings, my temps. shoot all the way up to 90 C. At stock speeds!!
Now, I've since learned that 40 C idle isn't that great to begin with, but why the 50 degree jump at load? I've routed all my cables about as perfectly as they can be and I'm feeling cool air being blown out the top and back of my case, so air flow doesn't seem to be the issue here.
When I applied the AS5 to the CPU, I thought I did a pretty good job with it. After I was finished removing layers of it, I could clearly see the CPU's IHS through the AS5 layer, so I don't think that was the issue at all. Now, when I tried to fill the valleys between the heat pipes and the aluminum alloy on the heat sink, I did struggle a bit with that, and didn't QUITE get ALL the valleys completely filled. I might have missed a small portion of 1 or 2 of them, but I generally thought I did a decent job with that as well. I did end up with some excess on the heat sink base of the AS5, but I ran a credit card along it like 25 or 30 times to try and get rid of as much of it as I could, and I ended up with about the same coat as on my CPU (heat sink base was pretty plainly visible through the AS5).
Now, I understand that I probably didn't do the absolutely greatest job with the AS5, but I thought it would be acceptable. I'm also unsure if I mounted the fan correctly as well. When I mounted it, I aligned it so the air would be blown into the heatsink, mounted on the second cooling fin from the top (as per the instruction manual), with the heatsink aligned with the motherboard such that the fan blows air through the heatsink and towards the back of the case towards the air exhaust fan.
Did I do something wrong? The only thing that I probably did a questionable job with is the actual mounting of the heatsink. I ended up moving the heatsink along the CPU's surface a couple times in my struggles to mount the damn thing into the back plate, however, since I didn't use the "line" method for applying the AS5, I didn't think this would be an issue. I thought I did an ok job of making sure the AS5 layer was as thin as possible. I can't see how I could get a 50 C increase in temps. at load. I wanted to ask here before I tried re-applying the AS5 or something like that in case the issue was something other than that.
And lastly, I'm teetering on the edge of coughing up some extra money and getting the Prolimatech Megahalems. I do want to overclock this thing to at least 3.8 GHz, and I've done some research and found that the Xigmatech Dark Knight will hit about 70-75C at load with maxed overclocked settings, with the Megahalems well ahead of it in performance. I'd like to know some opinions of this as well. My Dark Knight fits into this case (just barely clears the side fan by about an inch or so), and I found out the Megahalems is SLIGHTLY shorter, so this seems ideal for me.
I should also note that I've done no lapping on the heatsink or CPU. I shone a light through the CPU placed on top of the heatsink, and barely any light shone through, so I didn't feel lapping was necessary. Also, for what it's worth, my motherboard is automatically handling ALL voltage and clock speed settings. Any help would be MUCH appreciated!
Case: CoolerMaster HAF 932
CPU: Core i7 920, D0 stepping
Mobo: Asus P6T Deluxe V2
RAM: Triple Channel Corsair Dominator 6GB 1600 MHz
PSU: Corsair 850 Watt Modular
I'm using realtemp to get the temps. of my CPU cores, and when my system is idling at stock speeds with the overclocking settings in my BIOS all set to auto with Speed Step and all those other features enabled, I'm sitting at 40 C average about 15 hours into the AS5 curing process. What puzzles me is that when I run Prime95 with these settings, my temps. shoot all the way up to 90 C. At stock speeds!!
Now, I've since learned that 40 C idle isn't that great to begin with, but why the 50 degree jump at load? I've routed all my cables about as perfectly as they can be and I'm feeling cool air being blown out the top and back of my case, so air flow doesn't seem to be the issue here.
When I applied the AS5 to the CPU, I thought I did a pretty good job with it. After I was finished removing layers of it, I could clearly see the CPU's IHS through the AS5 layer, so I don't think that was the issue at all. Now, when I tried to fill the valleys between the heat pipes and the aluminum alloy on the heat sink, I did struggle a bit with that, and didn't QUITE get ALL the valleys completely filled. I might have missed a small portion of 1 or 2 of them, but I generally thought I did a decent job with that as well. I did end up with some excess on the heat sink base of the AS5, but I ran a credit card along it like 25 or 30 times to try and get rid of as much of it as I could, and I ended up with about the same coat as on my CPU (heat sink base was pretty plainly visible through the AS5).
Now, I understand that I probably didn't do the absolutely greatest job with the AS5, but I thought it would be acceptable. I'm also unsure if I mounted the fan correctly as well. When I mounted it, I aligned it so the air would be blown into the heatsink, mounted on the second cooling fin from the top (as per the instruction manual), with the heatsink aligned with the motherboard such that the fan blows air through the heatsink and towards the back of the case towards the air exhaust fan.
Did I do something wrong? The only thing that I probably did a questionable job with is the actual mounting of the heatsink. I ended up moving the heatsink along the CPU's surface a couple times in my struggles to mount the damn thing into the back plate, however, since I didn't use the "line" method for applying the AS5, I didn't think this would be an issue. I thought I did an ok job of making sure the AS5 layer was as thin as possible. I can't see how I could get a 50 C increase in temps. at load. I wanted to ask here before I tried re-applying the AS5 or something like that in case the issue was something other than that.
And lastly, I'm teetering on the edge of coughing up some extra money and getting the Prolimatech Megahalems. I do want to overclock this thing to at least 3.8 GHz, and I've done some research and found that the Xigmatech Dark Knight will hit about 70-75C at load with maxed overclocked settings, with the Megahalems well ahead of it in performance. I'd like to know some opinions of this as well. My Dark Knight fits into this case (just barely clears the side fan by about an inch or so), and I found out the Megahalems is SLIGHTLY shorter, so this seems ideal for me.
I should also note that I've done no lapping on the heatsink or CPU. I shone a light through the CPU placed on top of the heatsink, and barely any light shone through, so I didn't feel lapping was necessary. Also, for what it's worth, my motherboard is automatically handling ALL voltage and clock speed settings. Any help would be MUCH appreciated!
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