Hello all, it has been a few years since I got thermal compound (bought AS5 when it first came out) and since then I presume that some things may have changed and AS5 is no longer the best solution.
What do you feel is the best solution for thermal interface material to keep temps as low as possible. Preferably easy to install so I can't make any mistakes (always worries me with Arctic silver compounds), and works good for a standard setup of a core duo and normal air heat sink.
Due to the unique shape and sizes of the particles in Arctic Silver 5's conductive matrix, it will take a up to 200 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink or with a low speed fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop 2C to 5C over this "break-in" period. This break-in will occur during the normal use of the computer as long as the computer is turned off from time to time and the interface is allowed to cool to room temperature. Once the break-in is complete, the computer can be left on if desired.
I can't agree with the it won't make any difference comment .... lots of things can make a difference.....for example, simply rotating the Prolimatech Megahalems 90 degrees drops temp by 3 C. Here's some performance rankings to compare various products.....not ther eis no consistent winner as application techniques, CPU's, Heat Sinks all vary from review to review......one poroct may work best with one CPU / HS / Application method combo where it might get beat abd on another.