I was trying to use the suggested "two line" method for my dark knight heat sink, but I think I may have put too much. I tried to fill in the gaps on the heat sink and then make the two lines of goop. When I was reseating the heat sink, I looked under, and the cp had a circle of paste that did not quite reach the outside edges of the cpu chip and also seemed a bit... dark (granted I was using AS5 instead of the Tuniq I used before, so I'm thinking maybe the darker color threw me off and made it seem like I put on a thicker coat than I really did).
Is this a decent application?
![url]](/proxy.php?image=http%3A%2F%2F%5Burl%3Dhttp%3A%2F%2Fi938.photobucket.com%2Falbums%2Fad229%2Fextraextra12%2Fthermal-paste.jpg%5Dhttp%3A%2F%2Fi938.photobucket.com%2Falbums%2Fad229%2Fextraextra12%2Fthermal-paste.jpg%5B%2Furl%5D&hash=186106a2699b8a34f6ae180af103cd0a)
And also, the backplate I used came with adhesive on both sides, would it be better to leave the adhesive protector on the side that is NOT attached to the back of the motherboard, or just take it off and leave it sticky (my main concern is the heat). Thank you for your time!
Is this a decent application?
And also, the backplate I used came with adhesive on both sides, would it be better to leave the adhesive protector on the side that is NOT attached to the back of the motherboard, or just take it off and leave it sticky (my main concern is the heat). Thank you for your time!
. I think I'll see how the temps turn out based on this 
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