Current setup:
i7 930 @ 2.8 (stock)
ASUS P6T SE mobo
6GB G.SKILL PI (rated at DDR3-1600 1.5v, but running at DDR3-1066 1.5v)
Radeon HD 5850 (775/1125)
Samsung Spinpoint F3 1TB
Antec TruePower 650W
Antec 900 case (semi-modded for cable management)
Hi everyone. I'm looking for recommendations and advice on upgrading to an aftermarket cooler plus better thermal paste. It is my first time upgrading any CPU of any kind, but it's time.
Currently, I am running my i7 930 at stock speeds with the stock HSF + stock thermal paste. My idling temperatures are around 34-38 while loads at about 80-90% are 61-65. I have decent airflow with my system, and currently have my HD5850 OC'ed at it's max without voltage control (775/1125).
Because I wanted to leave everything at stock, my RAM is also running at DDR3-1066 at 1.5V, despite it being rated for a higher speed. I had originally tried running the RAM at DDR3-1600, however, my temps go up a tad bit, thus I wanted to stay stock and relatively cool.
My overall goal is to O/C my processor to around 3.4-3.6 GHz without temp changes in idling or load... or even better, the temperatures would actually be cooler! (if possible). I would also up my RAM back to its rated speed at DDR3-1600, and hopefully this would not change too much temps again. All this achieved with a better HSF and better thermal paste. My questions are as follows:
1) Which CPU HSF/cooler and thermal paste would you recommend for my setup and system? Keep in mind that I would like a HSF that is very easy to install (similar to the stock HSF maybe?) because I haven't installed an aftermarket HSF before.
2) Am I also able to still enable SpeedStep (or any optimizations) after O/C'ing? I would like my processor to idle and remain as cool as possible at the minimum needed clocks when not in full use. I guess I would want the O/C to really kick when I need it to go that high. Is this possible?
I'd figure if I use better cooling components, I would get more performance (more bang for the buck) and still not change the lifespan of my components. Thank you!
__________________
i7 930 @ 2.8 (stock)
ASUS P6T SE mobo
6GB G.SKILL PI (rated at DDR3-1600 1.5v, but running at DDR3-1066 1.5v)
Radeon HD 5850 (775/1125)
Samsung Spinpoint F3 1TB
Antec TruePower 650W
Antec 900 case (semi-modded for cable management)
Hi everyone. I'm looking for recommendations and advice on upgrading to an aftermarket cooler plus better thermal paste. It is my first time upgrading any CPU of any kind, but it's time.
Currently, I am running my i7 930 at stock speeds with the stock HSF + stock thermal paste. My idling temperatures are around 34-38 while loads at about 80-90% are 61-65. I have decent airflow with my system, and currently have my HD5850 OC'ed at it's max without voltage control (775/1125).
Because I wanted to leave everything at stock, my RAM is also running at DDR3-1066 at 1.5V, despite it being rated for a higher speed. I had originally tried running the RAM at DDR3-1600, however, my temps go up a tad bit, thus I wanted to stay stock and relatively cool.
My overall goal is to O/C my processor to around 3.4-3.6 GHz without temp changes in idling or load... or even better, the temperatures would actually be cooler! (if possible). I would also up my RAM back to its rated speed at DDR3-1600, and hopefully this would not change too much temps again. All this achieved with a better HSF and better thermal paste. My questions are as follows:
1) Which CPU HSF/cooler and thermal paste would you recommend for my setup and system? Keep in mind that I would like a HSF that is very easy to install (similar to the stock HSF maybe?) because I haven't installed an aftermarket HSF before.
2) Am I also able to still enable SpeedStep (or any optimizations) after O/C'ing? I would like my processor to idle and remain as cool as possible at the minimum needed clocks when not in full use. I guess I would want the O/C to really kick when I need it to go that high. Is this possible?
I'd figure if I use better cooling components, I would get more performance (more bang for the buck) and still not change the lifespan of my components. Thank you!
__________________
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