Which is best for me - I will not be overclocking the CPU or GPU for long life-span so, I wanted a smaller HSF that wouldn't take up too much room or be too heavy either. I just wanted something better and more reliable and longer lasting than the stock HSF from Intel. The Evo and 212+ just seems huge to me - so, I was curious about the CoolerMaster Gemin II S524 CPU Cooler.
MB: Gigabyte z77 UD5 or Gigabyte Z77X-UP5 TH (comes out at the end of June)
CPU: Ivy Bridge i7 3770
PSU: Seasonic X-750w
Case: Antec One Illusion
Oh, I'm sure any of them would suffice - I'm just trying to figure out which one has the smallest footprint. Since I'm not overclocking I just don't need a big massive HSF. I just don't know much at all about the GeminII and if it's really smaller.
You may be right, ram1009. I've never had Intel before so, this will be my first Intel system. I'm just going by what others have said regarding the heat issues that have come up with the new Ivy Bridge i7 CPU's. If I were just getting a Sandy Bridge CPU I doubt it would be much of an issue. Due to the comments below I'm not not sure if I should waste any time with Intel's stock HSF:
The plastic frame and pins from Intel's stock HSF deform over time and lose their clamping force. Everyone I know who has ever used one of Intel's push-pin HSFs has run into this problem (core temperatures shooting up and not coming back down for very long after changing the thermal paste and re-seating the stock HSF) around three years after their initial build.
Only fix in those cases is to upgrade to aftermarket cooling. The 212 + or EVO is an easy choice to make if it fits on your motherboard and in your case.
The i3/5/7 HSF is practically the same design as the Core2 HSF except for the addition of a copper core in the heatsink.
Most coolers with backplates use springs or spring-steel clips which do not suffer from thermal deformation unless you either over-bend them or heat them up to their shape-setting temperature which is typically in excess of 400C. Neither of which is likely to happen unless there is something even worse to worry about as the root cause.
The intel stock HSF have always been terrible. I just don't understand why they won't change their locking design to something more reliable.
Intel should consider not including the stock HSF and reduce CPU prices by about $20 or upgrade the damn thing by replacing the plastic frame with something stronger so that it doesn't deform over time and loosen up causing potential over-heating issues such as explained in this thread - http://www.tomshardware.com/forum/337344-28-hits-shuts-...
^ This is true in general, amuffin. However, I'm a bit concerned over the heat issues of the Ivy Bridge i7 CPU's which seem to have a tendency to get pretty hot. I realize that's more of an issue with over-clockers but, I have a small business that I run out of my apartment that does not have central air so, in the summer months the indoor room temps can get up to 85F (31C).
^ You don't think my indoor room temps of up to 85F (31C) or more will be a problem then?
Here's a new CPU cooler design:
Sandia Develops Amazingly Efficient CPU Cooler
"Researchers at Sandia National Laboratories claim to have developed, by today's standards, an insanely efficient CPU cooler fan. The "Sandia Cooler" features curved fins and achieves 30x improvement in heat transfer over a commercial Dynatron G950 cooler that served as comparison..... http://www.tomshardware.com/news/cpu-cooler-sandia-heat...
There is a correlation between size, noise, and performance.
Any of the better 92mm fan coolers are an improvement on stock performance, the TX3 latest variant (push pin?) or the Xigmatek LOKI (bolt thru).
Basically top down coolers are supposed to help cool mothboard VRMs and Memory.
Catch is how they are affected by case airflow.
Vertical coolers are supposed to enhance case airflow.
In a clean dust filtered (or low dust environment) case the stock cooler does well enough unless highly stressed. (can become noisy at full fan speed)
Aftermarket coolers increase fan size and airflow/heat transfer (in my experience plug up more slowly, this may be because I add/clean filters to/for my cases)
There is no magic though, air in/heat out is the objective. Video cards can add heat and obstruction, making a larger more capable cooler desireable.
I use a GeminII S524 for a low profile case, it is not as efficient as lower priced vertical coolers but fits, aligns with case side screen (now air filtered) and has kept temperatures down. Admittedly I suffer a dusty environment, and like cooling "over" margin.
If your case accepts a 212+ or 212 EVO they are likely the best choice for that case.
I went ahead and order the Evo just to be on the safe side with my 85F indoor room temps. I don't like how big it is, which is why I was considering the GeminII. Perhaps future HSF's will get smaller yet more efficient, we'll see.