echo4019 :
Thermal paste, dot in the middle and let the heat sink spread it or spread it before placement of heat sink?
Thanks
Well it's not like we don't see this question regularly!
Regardless of what you're told regarding my way is better than your way you'll get flooded with here.
The best thing for your own knowledge is try both, pull the heat sink each way and inspect the thermal footprint, that way you will know exactly which method works the best for your specific heat sink.
The most important thing for you to understand is thermal compound is most effective in the thinnest application layer possible, you are only filling the microscopic surfaces between the 2 contacting surfaces.
When thermal compound is properly applied it conducts the heat from the heat spreader to the heat sink, when too much is applied it acts more like an insulator instead of a conductor, and that's bad.
You want to end up with the thinnest layer possible, fully covering the CPU heat spreader, that's why pulling the heat sink and inspecting the thermal footprint will tell you exactly what's happening.
It's much better to know for sure, than to guess, or assume!
If you want the best thermal cooling performance from the thermal compound be positive you've properly applied it in the beginnig, you don't want heat issues down the road, pull the heat sink after the problems and discover,
a partial or way over applied thermal footprint then.
Ryan