Hi
I am trying to install the Antec H2O 920 in my system with mobo Asus P8Pp67 pro but the adhesive foam in plastic backplate is covering come solder joints in the motherboard.Is this normal or should I revert back to stock heatsink.
Though the backplate is of plastic ,and there is no question of solder joints getting short,but I am afraid the adhesive might come down out of heat and may cause problems.
Please guide.
I am trying to install the Antec H2O 920 in my system with mobo Asus P8Pp67 pro but the adhesive foam in plastic backplate is covering come solder joints in the motherboard.Is this normal or should I revert back to stock heatsink.
Though the backplate is of plastic ,and there is no question of solder joints getting short,but I am afraid the adhesive might come down out of heat and may cause problems.
Please guide.