I've recently reapplied a thermal paste to my CPU and got assembled my notebook back. But then after couple of hours for some reason I disassembled it again and the CPU was detached from a heatsink. I assembled it again back and I wonder wether I should have reapplied a thermal compound again that time. Any advice? The problem is that my notebook is quite fragile and I don't want to make it even worse (so far the wifi kicked off, but that seems like a software stuff)