I just bought a new rig and have finished setting it up, including the application of thermal paste
in between the HSF and the CPU. I am aware of the curing needed for the thermal paste and I have
some questions about it.
1. Is it a rule of thumb that you should run the computer right after applying the thermal paste?
I have heard that the curing time usually takes about 20 hours, but some have 5 hours or less.
2. What could happen if you do not run the computer after applying it?
It's been three (3) days since I have assembled my computer but I still have not installed the
operating system (windows 7 64-bit) since I am really busy at school.
Should I be worried regarding the curing thing as it might affect voids in between HSF/CPU
or even the temperature?
Should I re-apply the thermal paste when I am about to install the OS?
in between the HSF and the CPU. I am aware of the curing needed for the thermal paste and I have
some questions about it.
1. Is it a rule of thumb that you should run the computer right after applying the thermal paste?
I have heard that the curing time usually takes about 20 hours, but some have 5 hours or less.
2. What could happen if you do not run the computer after applying it?
It's been three (3) days since I have assembled my computer but I still have not installed the
operating system (windows 7 64-bit) since I am really busy at school.
Should I be worried regarding the curing thing as it might affect voids in between HSF/CPU
or even the temperature?
Should I re-apply the thermal paste when I am about to install the OS?