I recently purchased an Asus M4A88TD-M/USB3. While installing the CPU, heat sink and fan onto the motherboard, I bumped the NB (not hard) with the back of my hand and noticed it was loose. Upon closer instpection, by removing the NB, I found what looked like thermal compound. It was, however, very hard. I am assuming now, that it was adhesive rather then thermal compound. I do know this....that once loose the NB did not sit firm/tight against the die. I start experiencing over heating symtoms. I then remove the NB once again and used Artic Silver thermal compound between the heat sink and die. This did seem to help. What I don't know is: Was an adhesive used in the manufacturing proccess or had the thermal compound dried out?