The reflow soldering process is a lot more complex than simply putting the board in an oven, not to mention that the temperature tolerances in a cooking stove are a whole lot wider than they are in a reflow soldering oven. Another problem with the cooking stove is that IR exposure and overall temperature are far more uneven; in the reflow process, sensitive components would have a heat shield to minimize exposure to IR heating.
Also, in the reflow process, components are not supposed to be exposed to the maximum reflow process temperature (185-195C) for more than 30-45 SECONDS. 10 minutes of it probably killed the board for good.
If you simply tossed the board in the oven and took it out when 'done', you may also have caused additional damage due to uneven heating/cooling.