Die shinks tend to be 0.7 of the last one, this helps keep the math a bit simpler and more consistent while doubling the amount of transistors you can fit in an area on the chip. The small jumps let them learn important things as they go that they will need for the next jumps. Everytime there is a die shrink there is a long period of working out the issues to improve yields, if you were to make a larger jump it would take much longer to get it all sorted out.
I also doubt that the design teams would be able to make use of a massive increase in available transistors. For CPUs the manufacturing nodes coming up after 32 nm are 22 nm, 16 nm, then 11 nm. If you were to try to jump from 32 nm to 11 nm you would have the option of putting almost 8x as many transistors on the same sized chip in a similar power envelope, but it would take several years to finally figure out and fix all the problems with the system so the initial yields would be abysmal.