Hey before i start on the problems I'm having here are the specs
-- Intel Pentiumium D 925 -- codename presler
-- Gigabyte 945gcm-s2l Motherboardoard
-- 4gig ddr2 ram -- (MHz00mhz corsier) -- one stick has heat skirt
-- 2 x sata HD -- 1tb
-- Nvidia GT 220 1gig video
-- Power coolerercooler PSU 430
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Case - small stock standard case
inside case fan x 1 sml - set to exh hot air from powercooler psu which is intaking air from back also. ( only venting option's on stock case )
please note that before all these tests where done, i had cleaned the entire pc of dust using a none static brush
and discharging static by touching psu and case.
Before doing each apply of compound i used alco wipe + new cloth to clean and previous compounds
-----------------------------------------------------
So the Problem is that the cpu is running really hot -- was sitting at 48-50 before i started cleaning the dust from the pc ( wasent that bad to begin with )
So i decided to apply some more thermal compound to the cpu -- i first cleaned it up like stated above , applied compound using the Dob technique from centre of cpu -- ( pea sized ) i then used the intel heat sink ( 4 clip type ) and pushed it down to spread the compound like i normaly do -- my computer cpu sits at 31* OC - 41* stressed
pushed in the 4 heat sink clips ( yes i did reset them and clip them down from op sides )
This started to display temps of 55-58* in bios
speed fan was giving reading's of -2 ( coretemp wouldent work )
Started to think that i may have went overboard on the compound so i decided to clean it back up and applied about 3/4 of the amount before , i reset clips on heat sink -- pushed the heatsink firmly into place and then removed it made sure the compound was nice then mounted the heatsink again and pushed clips down again.
this displayed temps of 55-59 i was then like wtf -- hadent applied to much compound looked to be a fine when i was attatching the heatsink , -- not being my first time doing this either.
decided to query the net on simular problems and found that people had temp problems with the 925 D chipset when applying compound with Dob technique and a compound apply in a line technique was solving there problems ( a thin line from centre of core 1 - 2 )
decided with no other leads to give that a go , so yet again took the pc apart and cleaned the old compound off and applied it in the line technique only using the same amount of compound from test 2 -- i then put the pc back together like previously and temp readings are @ 54-59* in bios
and go to dangerous high for this cpu during a stress test on prime and i have to stop at 61 -- ( 62.3* is max )
speed fan -2 as always
so now im stumped at to what the problem is here , iv checked the airflows , thought it could be the gauge but its giving readings simular in speedfan for cpu. All fans are running at 2400+. so any ideas here would be fantastic.
-- Intel Pentiumium D 925 -- codename presler
-- Gigabyte 945gcm-s2l Motherboardoard
-- 4gig ddr2 ram -- (MHz00mhz corsier) -- one stick has heat skirt
-- 2 x sata HD -- 1tb
-- Nvidia GT 220 1gig video
-- Power coolerercooler PSU 430
-----------------------------------------------------
Case - small stock standard case
inside case fan x 1 sml - set to exh hot air from powercooler psu which is intaking air from back also. ( only venting option's on stock case )
please note that before all these tests where done, i had cleaned the entire pc of dust using a none static brush
and discharging static by touching psu and case.
Before doing each apply of compound i used alco wipe + new cloth to clean and previous compounds
-----------------------------------------------------
So the Problem is that the cpu is running really hot -- was sitting at 48-50 before i started cleaning the dust from the pc ( wasent that bad to begin with )
So i decided to apply some more thermal compound to the cpu -- i first cleaned it up like stated above , applied compound using the Dob technique from centre of cpu -- ( pea sized ) i then used the intel heat sink ( 4 clip type ) and pushed it down to spread the compound like i normaly do -- my computer cpu sits at 31* OC - 41* stressed
pushed in the 4 heat sink clips ( yes i did reset them and clip them down from op sides )
This started to display temps of 55-58* in bios
speed fan was giving reading's of -2 ( coretemp wouldent work )
Started to think that i may have went overboard on the compound so i decided to clean it back up and applied about 3/4 of the amount before , i reset clips on heat sink -- pushed the heatsink firmly into place and then removed it made sure the compound was nice then mounted the heatsink again and pushed clips down again.
this displayed temps of 55-59 i was then like wtf -- hadent applied to much compound looked to be a fine when i was attatching the heatsink , -- not being my first time doing this either.
decided to query the net on simular problems and found that people had temp problems with the 925 D chipset when applying compound with Dob technique and a compound apply in a line technique was solving there problems ( a thin line from centre of core 1 - 2 )
decided with no other leads to give that a go , so yet again took the pc apart and cleaned the old compound off and applied it in the line technique only using the same amount of compound from test 2 -- i then put the pc back together like previously and temp readings are @ 54-59* in bios
and go to dangerous high for this cpu during a stress test on prime and i have to stop at 61 -- ( 62.3* is max )
speed fan -2 as always
so now im stumped at to what the problem is here , iv checked the airflows , thought it could be the gauge but its giving readings simular in speedfan for cpu. All fans are running at 2400+. so any ideas here would be fantastic.