Inside a CPU there is VERY fine connecting wires made from gold. The gold is used to enhance the conductivity of the part.
 

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Titan
Moderator
Traces within the IC are copper. Solder balls between the CPU die and substrate are likely low-temperature eutectic alloys like Tin-Bismuth. Traces on the substrate are copper. The plating on pins/pads and most other connections other than power is usually gold but cheap non-critical connectors may be tin-plated.
 

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Titan
Moderator

Gold is rarely used inside ICs since it has worse conductivity than copper and is horribly more expensive. Silver has the highest room-temperature conductivity among pure metals.

Aluminum was used inside ICs until ~1999 due to being one of the easiest metals to work with but it was becoming a performance bottleneck due to relatively low conductivity which is why research into ways of preventing copper from diffusing or oxidizing during IC processing and operation became a major focus. After Intel and IBM figured out how to use copper on silicon, copper quickly became the most commonly used metal in mass-produced VLSI ICs and still is to this day.

Since silver is much more expensive than copper, I doubt we will see silver used in mass-produced ICs. The performance gains are unlikely to justify the 50X more expensive metal and massive R&D investments.