Well, it's been about 5 or 6 months since Intel was outed for having cut corners on the heatspreader contact method causing higher temps (fluxless solder?).
My question is - has Intel corrected this since this came out or are they still using the same stuff? I'm asking because I'm nearly ready to purchase one of these. It sounds like heat is still manageable, but hoping maybe they've made the switch. Any thoughts?
Yes for the 3rd generation Intel® Core™ processor we moved to a TIM (Thermal Interface Material). For the 3rd generation processors we will be staying with TIM (there are no plans to change). Now for the next generation processors this may change.
Not knowing a LOT about the various heatspreader options available (newb in this area), can I ask why Intel has gone with this method? I sincerely don't know why one choice is better than another (with the exception of heat related issues that I keep reading about). I want to feel good about this purchase despite all of the negative hype.