When I applied thermal paste I did spread technique (was a toss up between dot technique). Also I had a little trouble with heatsink so I had to lift it after applying thermal paste to adjust bracket. Could that have caused a problem?
Core#0 Value=33c Min=24c Max=44c
Core#1 Value=32c min=28c max=49c
core#2 value=33c min=25c max=47c
core#3 value=34c min=29c max=50c
Package value=36c min=30c max=50c
I haven't done any benchmarking or stress tests yet. I was planning on using Prime95 is that a good one?