If different memory chips have almost identical specs, shouldn't they perform the same?
Not at all. Only in some cases.
The reason is that semiconductor manufacturers aim for a general specification. And often the results are much better, slightly better, or on par with the general specification, or even worse then the specification.
For example, a given process may test a few hundred parameters on a memory chip for a DDR-400 specification. The resulting chips may be classified as follows for the spec:
200/200 pass: Chip is labeled as DDR-400.
In fact.. many of the chips are capable of DDR500+
190/200 pass: chip is labeled as DDR-333.
No possibility of reaching DDR-400
180/200 pass: chip is labeled as DDR-266.
No possibility of reaching DDR-333
< 180/200 pass: bad chips or sold as downgraded parts.
Some companies like Samsung and Hynix offer DDR-500 chips. Of course, they have to perform a high standard test. However, no company officially supports DDR-500 chips.
By the way.. contrary to popular belief.. there is no standard for DDR-400 CL2 or CL2.5. You will see that modules with these ratings are built from chips that are offically rated at DDR-400 CL3. It's just that the third parties who buys these chips perform additional testing to ensure they run at DDR-400 CL2 or CL2.5.
Expensive memory is just tested more often. =)
Lower latency modules are geared towards gamers and enthusiasts, where data integrity and application compatibility are not as important as perfromance. AKA overclockers. hehe
Most professional workstations follow standard specification.
<A HREF="http://forumz.tomshardware.com/hardware/modules.php?name=Forums&file=viewtopic&p=114786#114786" target="_new">Another somewhat related thread</A>
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