P4 heatsink on second assemblage

Hello.

I bought a boxed P4 2.53GHz which heatsink came with a black thermal material under it. I had read that no other thermal solution (e.g. paste) was necessary, so I assembled the processor and heatsink as they came. The system ran without problems and so did all my tests.

However, after the tests were done and it came time to disassemble (I am travelling back home), I noticed something: although the heatsink came off of the processor, the black material on its bottom was not intact anymore. Some parts had stayed on the processor's surface, which became foggy. Overall, the four corners and the center were the most affected areas.

At first, I thought I had done something wrong. After some searching, though, I found that the outcome was "expected". I then contacted Intel's technical support looking for advice on how to proceed next time I assemble the system. I was basically given two options:

1. Remove the remaining material from the bottom of the heatsink and that which got stuck to the processor's surface and then use some thermal paste instead.

2. Leave both the heatsink and processor as they are as they would fit properly upon reassemblage.

Although option 2 is the simplest, I was suspicious about it after reading an article [1] on Intel's website which classified the need for replacing the thermal material at each installation as critical. On the other hand, I have never done what is suggested on item 1.

Since I do not wish to risk damaging my new processor, I would really appreciate if the more experienced fellows could help me with some questions:

1) Which way should I go? Getting rid of the original thermal material and apply paste on my own or leaving things as they are? Why?

2) Case the best option for me is 1, I would need some information:

2.a) What do I need in order to do the removal of the thermal material from both the heatsink's bottom and the processor's surface? What is the procedure?

2.b) I have read several good references to the "Artic Silver 3" compound. Is this the one to choose?

2.c) Is applying the compound simple? Are there important safety/efficiency tips to be observed when doing so?

Sorry for possibly having made a big deal out of something which would be trivial for most of you, but I am new to thermal solutions and their related issues; the last system I assembled was a Pentium 166 MHz. I only want to make sure my system will be able to run stably.

[1] http://support.intel.com/support/p [...] tm#Removal

Thank you very much.

--
Zunino

Well option 2 would be okay, assuming that the bits fittd back together perfectly. The problme is of course that they usually dont, leading to airgaps and increased temps.

Its fan fan better to remove the gunk with a creditcard and some rubbing alcohol then apply a thin layer of thermal paster. Yoou will probably gett cooler temps as well

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