Ok, I'm going to be building up a shuttle XPC system within the next 3 months, either a P4 something or an AMD something (I'll make the CPU choice closer to the time). Its not likely I'll be overclocking. My question is, what would the experienced members reccomend: thermal paste or the bog standard thermal pad on the hsf?
Well I'm not one of the most experienced here, but until they come along I'll add my two cents worth: Get thermal paste (e.g., arctic silver #5). I don't like the wax pad AMD heatsinks come with. I know I'm going to add/remove cpu's and I think the paste is easier to work with (don't wann clean off the wax). As far as Intel cpu's, I've read of others who have had problems getting the heatsink off the cpu (some broken cpu's resulted). There again, paste seems much preferable.
XP 2000+
MSI KT3 ULTRA-2 KT333
Maxtor 60GB ATA 133 7200RPM
512MB PC2700
ABIT G4 Ti4200 OTES 64MB
Win98SE
Has anyone found a source to buy small quantities of the
Phase Change Thermal Interface Compounds that are listed
on AMD's web site as approved by them? Searching with
Google has turned up nothing for me.
I'm in a hurry and want to put my system together and prefer
to abide by AMD's recommendations.
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