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Guest
Guest
I just got a 1.2 Thunderbird and will be recieving an Alpha PEP66T HSF shortly. The Thunderbird has the little pads on each corner and the bottom of the HSF is flat. I was told by the CoolerGuys that the thermal compound should only be applied to the center crystal portion of the chip during mounting.
Does that mean that the HS is not actually resting on the chip but only making contact via the thermal compound?
My confusion is arising from the fact that the bottom of the HS is huge compared to the tiny size of the crystal and is seems like there should be more contact between the chip and the HS.
I'm real new the HSF/Chip stuff. Any information/advice/experiences you fine people could impart upon me would be greatly appreciated!
Thanks,
Mosh
Does that mean that the HS is not actually resting on the chip but only making contact via the thermal compound?
My confusion is arising from the fact that the bottom of the HS is huge compared to the tiny size of the crystal and is seems like there should be more contact between the chip and the HS.
I'm real new the HSF/Chip stuff. Any information/advice/experiences you fine people could impart upon me would be greatly appreciated!
Thanks,
Mosh