Some cool [H]ard picture

The picture of the celeron brought an idea to mind.
With the heat generated by modern CPUs contiuing to rise, maybe it's time to radiate from the bottom half of the chip also.

In other words, have a hole in the motherboard big enough to mount a heatsink on from the bottom as well. At least to start with, a passive heatsink might be adequate. Of course, it would mean a substantial redesign for cases also.


In theory, there is no difference between theory and practice.
In practice, there is.

The celeron in the picture is in a PPGA (Plastic Pin Grid Array) package. With this design, since the actual core is on the bottom (pin side), the heat must pass through the ceramic chip before it reaches the heatsink.

The newer celerons (as with nearly all chips now) come in the FC-PGA (Flip-Chip Pin Grid Array) package. The core is mounted on the upper side of the chip, and the heatsink makes direct contact with the core resulting in much better heat transfer.

My celery 266 which has been o/c'd to 400 for years now has always had a sandwich... A standard cooler on the back with a peltier on the front (where the heatsink normally goes).

I love the idea of being able to do that with a pga chip too.

Hey, maybe that could be the next foreign movie of the year...

"Melting intel, hidden duron."

Cow with legs spread wide either dead or playing 'cello.

It would have to be from Taiwan though