Crashman is right, but theres a better way to do it, making sure you fill every crack while having the absolute minimum AS on the die.
put a good size dot on the heatsink(where the die will contact) and use a credit card or razor blade to kind of smush it around.(like drywall mud kind of), slide the razor over the AS making it flatten into the heatsink, do this for a while and then scrape off most of the excess.
Then take some of this excess and put it on the core, use the razorblade to flatten it out and scrape off almost ALL of it. Then put on your heatsink and ta daaa. You have filled up all the micro cracks in the hsf with AS and have a very thin layer of it on the die.
Does that make sense, I found it difficult to describe what to do to the heatsink bottom with the AS.
~Matisaro~
"Friends don't let friends buy Pentiums"
~Tbird1.3@1.55~