nice article i read at the register:
*300mm wafer fab up by the end of this year
*0.13 micron early next year. complete fab update to 0.13 by mid next year
*then 0.13u mixed with SIO technology
mmmmmmm
so this all equals
athlon4+thermal protection+ die shrink+more efficient construction.
www.theregister.co.uk/content/3/21260.html
I'll respect your comments & opinions, even if i disagree with them, Provided you dispay maturity.
*300mm wafer fab up by the end of this year
*0.13 micron early next year. complete fab update to 0.13 by mid next year
*then 0.13u mixed with SIO technology
mmmmmmm
so this all equals
athlon4+thermal protection+ die shrink+more efficient construction.
www.theregister.co.uk/content/3/21260.html
I'll respect your comments & opinions, even if i disagree with them, Provided you dispay maturity.