I tried to follow the other thread, but it was all abuse.
I find that this review is critically flawed. It does show that Intel's thermal management is superiour to AMD's. The question remaining, though, is that of OVER engineering.
The scenarios used in the description of failures that affect thermal management are the fan stopping and the heatsink falling off. Two GOOD scenarios that should be managed.
However, the video clearly shoes NEITHER of these scenarios being followed.
If the HSF does come off, it will ALWAYS be when the unit is in transport, and NOT SWITCHED ON. The test, though, had the HSF at full load, full temperature and then the HSF removed.
Umm, I don't think so! How many of us move our PC around violently enough to loose the HSF with it still running!
This obviously does not give the thermal diode in the AMD solution enough time to throttle the CPU. The superior Intel diode does react fast enough.
However, I would guess that REALISTIC tests:
1) Fan failure (but Heat Sink OK) for a fully loaded system.
2) HSF removal and THEN turn the system on.
would show that the thermal diode in the AMD CPU reacting fast enough to save the CPU.
I'm not a particular fan of either CPU. I run AMD at home, Intel at work. Both are good.
Intel clearly has the best solution. My point is that the AMD solution has been delivered to provide for REAL scenarios, and that as not tested. Intel have perhaps over-engineered their CPU with "the mother of all thermal diodes", and your test is the only time it would pay off. The rest of the time, the cheaper AMD part would do the job.
Just another reason Intel CPUs are more expensive?
Long Haired Git
P.S. Unlike the other thread, how about we stay on topic?
I find that this review is critically flawed. It does show that Intel's thermal management is superiour to AMD's. The question remaining, though, is that of OVER engineering.
The scenarios used in the description of failures that affect thermal management are the fan stopping and the heatsink falling off. Two GOOD scenarios that should be managed.
However, the video clearly shoes NEITHER of these scenarios being followed.
If the HSF does come off, it will ALWAYS be when the unit is in transport, and NOT SWITCHED ON. The test, though, had the HSF at full load, full temperature and then the HSF removed.
Umm, I don't think so! How many of us move our PC around violently enough to loose the HSF with it still running!
This obviously does not give the thermal diode in the AMD solution enough time to throttle the CPU. The superior Intel diode does react fast enough.
However, I would guess that REALISTIC tests:
1) Fan failure (but Heat Sink OK) for a fully loaded system.
2) HSF removal and THEN turn the system on.
would show that the thermal diode in the AMD CPU reacting fast enough to save the CPU.
I'm not a particular fan of either CPU. I run AMD at home, Intel at work. Both are good.
Intel clearly has the best solution. My point is that the AMD solution has been delivered to provide for REAL scenarios, and that as not tested. Intel have perhaps over-engineered their CPU with "the mother of all thermal diodes", and your test is the only time it would pay off. The rest of the time, the cheaper AMD part would do the job.
Just another reason Intel CPUs are more expensive?
Long Haired Git
P.S. Unlike the other thread, how about we stay on topic?
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