I've discovered it's better to use too little thermal compound than to use too much. Apparently, if you have too much of the stuff, it will ooze out when the heat sink is clamped on. The excess goo will transfer heat from the die into the black sealant around the die, thus cycling heat back into the chip.
My CPU kept overheating (90-95 C!). I took off the heat sink, cleaned up the goop and reapplied it. But this time, I used a Q-tip with rubbing alcohol to clean around the edges of the die so that ABSOLUTELY NO compound was running off the edges. I even made sure the area covered by compound was a hair short of the edges of the die. Now my system runs at a comfortable 59.5 C.
I know some, if not most of you already knew this. I just thought I'd share the experience anyway...
-DOOM
"Ultimately, there is no knowledge -- only belief."
My CPU kept overheating (90-95 C!). I took off the heat sink, cleaned up the goop and reapplied it. But this time, I used a Q-tip with rubbing alcohol to clean around the edges of the die so that ABSOLUTELY NO compound was running off the edges. I even made sure the area covered by compound was a hair short of the edges of the die. Now my system runs at a comfortable 59.5 C.
I know some, if not most of you already knew this. I just thought I'd share the experience anyway...
-DOOM
"Ultimately, there is no knowledge -- only belief."