hi i've just recently built a new anthlon system out of the 1.2 ghz tbird retail version.....i had to reseat the cpu after the intial startup and some of the thermal past was melted and i tried to reseat in the same position but it was hard.....i was wondering if i should just go out and get some thermal paste and reseat again??? my cpu temp is running around 50 degrees C... Will the lack of contact affect me later???
if you want to remove the HSF in the future, i suggest u scrape off the gunk.
the main issue is this:
when u first put on the HSF and turn on, the heat melts the gunk into shape, filling all the microscopic gaps.
problem is its not as good the second time round, and even worse, when u take your HSF off there is a square cpu shamed hole in the hunk. if its not put back on accurately the core could be caught on one of the edges in the gunk, and large portions of the core's surface would not be actually touching anything.
if that were the case, it would most likely overheat before the gunk had a chance to remelt.
thermal pads really are for beginners. use once solutions.
besides, its well known that those heat pads dont have the best thermal properties. a thin layer of thermal paste is much better.
Excuse me for a moment. I need to drive my ergonomic wheely chair over a sheet of bubble wrap!