die size and cooling

im no engineer but i think that if the transistors were farther apart they would require more power to pass current between them. not sure what it would do to heat, but it would make prices a lot higher, and the foot print on the mother board would be much larger=higher cost again. and if they started fusing heat sinks to the core where would that leave artic silver, we cant let this happen to artic silver!

i went to the tomshardware forums and all i got was this lousy signature.

larger die area will certainly make cooling easier, not that the chip will dissipate less power, but lesser power will be dissipated per sq.mm, and that would help cooling.

but rather than reducing the cost benefit of going for smaller 0.13u technology with more die per wafer, it will actually be costlier because you havent improved the yeild even with a costlier process!

among the other things that would be affected by this larger die size is the maximum speed. longer the circuit traces, higher will be the inductance and capacitance between adjacent tracks (the silicon oxide acts as a dielectric) limiting the maximum frequency the die could achieve. one more factor is the voltage required to operate a longer conductor, it will certainly be a bit higher which would actually contribute to the powre consumed by the die and in turn neccesitate better cooling!

whoever thought of it, might have got it wrong. its actually difficult to balance the proc and cons of such a trick, especially in the market conditions like these. probabely the advantages slightly or more thn outweigh the disadvantages of this technology.

remember the Quantum's Bigfoot technology? Introducing a 5.25" hard disk when 3/5" ones were becoming mainstream was a marketing hype, old wine in a new bottle.

Its certainly not with silicon though, the heat spreader and active cooling are much better choices than making a larger die.

girish

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If you make the connections inside the die longer, the resistance of the connections will raise, also you will need more Voltage which gives more powerconsuption and thus more heat.
They also will cost more, and will be more difficult to transport (which also rices costs).
The only advantage so far is that it is better to cool, although it is going to produce more heat. But good heat conducting materials and a good heatspreader will work perfect on smaller cores.

My case has so many fans that it hovers above the ground .

Better make it copper, it will increase cooling performance, but one problem it that it will make the CPU much bigger to handle, and every motherboard has to made to fit with the heatsink, I don't think OEM companys will be happy with it.

My case has so many fans that it hovers above the ground .

you must be refering to those *negative* price reductions we all got to experience with the arrival of the NW parts.