IBM start producing wafer for others

Schmide

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<A HREF="http://www.anandtech.com/news/shownews.html?i=17376&t=pn" target="_new">http://www.anandtech.com/news/shownews.html?i=17376&t=pn</A>

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eden

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If it's true, AMD would definitly benefit.
I'll say no more until I can hear some more feedback and news.

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juin

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it's true, AMD would definitly benefit.
I'll say no more until I can hear some more feedback and news.

Intel will be losing (at lease a part of it) of is biggest advantage better manufacturing cost performance volume.

If IBM start to do so why intel dont offer there 90 NM process to ATI.ATI and intel are closer and closer.I have allready post about that about 6 month ago.

Now what to do??
 

eden

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IBM is better than Intel at fabs?

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IIB

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I dont see what AMD have to do with this. can you guys explain?

This post is best viewed with common sense enabled
 

eden

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Me neither, but Juin seems to beleive it does, as in AMD using IBM's fab space.

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Dark_Archonis

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Ha, IBM is good, but it's not "better" than Intel. Both IBM and Intel have had their share of innovation, and creative new products.

Personally, I'm with Eden. What does this have to do with AMD? AMD's already partnered with TSMC and UMC.

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juin

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nothing mention on it right now maybe not even for year.

IBM intel are equal on R&D innovation but in real stuff there Power 4 use less advanced micron process.In the real world intel lead.

Now what to do??
 

Dark_Archonis

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Ya, I agree. Intel usually leads the industry in terms of manufacturing process.

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eden

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Depends, IBM came up with SOI, which, overcomed all problems, is advantageous in future clock speeds.

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juin

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Depends, IBM came up with SOI, which, overcomed all problems, is advantageous in future clock speeds.


It only help on leak and cost way more IBM still have a low yield.Is like saying strained silicon it the way on future becasue is raise drive current.All this technique attack 1 point of physical limitation.

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IIB

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Power 4 was designed for the 180nm process - you can't just switch process evry day with such large CPUs.

Itanium 2 - 180nm Bulk CMOS with aluminium interconnects.
Power 4 - 180nm Silicon on Insulator with Copper interconects.

So please...
wanna bet Power 4 will mov to 130nm before Itanium?

This post is best viewed with common sense enabled<P ID="edit"><FONT SIZE=-1><EM>Edited by iib on 10/07/02 05:19 PM.</EM></FONT></P>
 

juin

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i do madison as allready been show working.I take the bet 2003 Q1 or Q2 for intel vs ??? i not even sure that Ibm will not skip 0.13 for something better for Power 5

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IIB

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Wow... and AMD should a working silicon of Hammer on 0.13SOI a year brfore it will be launched - this kind of demos can be througn around as soon as 30 days after A0 - they are almos meaningless.

Power 4 is planed to move 0.13SOI - and it will happen before madison is launched.


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