I note that the P4 3.06 GHz HT CPU uses more power and probably generates more heat. I noted also from the article that it uses a redesigned heatsink with a copper core and that attention is given to nearby electronics on the MB.
Has anyone experienced the new chip from a heat buildup point of view? Just wondering..
Thanks a lot.
Bob Harris
Has anyone experienced the new chip from a heat buildup point of view? Just wondering..
Thanks a lot.
Bob Harris