Heat & P4 3.06 HT

Harris2508

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Dec 1, 2002
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I note that the P4 3.06 GHz HT CPU uses more power and probably generates more heat. I noted also from the article that it uses a redesigned heatsink with a copper core and that attention is given to nearby electronics on the MB.

Has anyone experienced the new chip from a heat buildup point of view? Just wondering..

Thanks a lot.

Bob Harris
 

thanatos_minor

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Nov 30, 2002
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My new Shuttle with the HT enabled MB and 3.06 P4 runs OGR 24/7 and I only have the heatpipe sys with a small variable speed fan like 80mm. Even with 2 fast HDDs and a ATI 9700 Pro, it stays cool as a cucumber...well almost. No OCing, though, not even on the VDO card.

Dual CPU freak. 2 Xeon systems and a Shuttle with HT running W2k, XP Pro, and Suse Linux 8.1
 

Harris2508

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Dec 1, 2002
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Thanks for the reply. If you're running the intensive stuff it sounds like and the CPU is staying cool, I guess Intel has dealt with the issue well. It's always been my experience that Intel does a better job of heat management than AMD, in most cases.

Thanks again.

--Bob