Is this basically like a mini vapor chamber? Phones are already fanless. Can this method dissipate a higher tdp of heat?
How much heat the heat pipe can transfer is pointless since the ultimate heatsink in mobile devices is the device's body. No matter how good the heatpipe may be, you still do not want to exceed what power the device's body can dissipate without generating uncomfortable heating.
Personally, I find hotspot - uneven heating - on modern devices somewhat annoying so I would welcome lower TDP chips with more efficient heat-spreading to eliminate hotspots.