Hello! Im new here and i have turned to this site for help many times, and now i need it to solve a question about Liquid Cooling!
So im planning on making a build using the massive case the 900D, i intend on having plenty of Graphics cards (EVGA GTX 770 4Gb SC) in Tri-SLI, and i will cool my i7 - 3930K. I intend to use XSPC parts for this build. However, while i do know a thing or two about LC, there seems to be a bit of mystery over Intake VS. Exhaust. One of the companies i read from suggested to use the top rad as intake in some cases, to cool the Mobo. Now i figure that could blow hot air back into the case. I do know that having a larger amount of intake VS exhaust is supposedly better to prevent "dead spots" of air in the case. I will be using AT LEAST 4 Fans on their own and have two fan loaded Rads (Perhaps a 360 on top and a 480 on bottom) and its possible ill use the 2 fans on the other side in the bottom as well.
What i was thinking:
-Use the top 360 (or max it to 480) Rad to exhaust the hot air (Comes from GPU, Leaves to CPU)
-Use the bottom 480 Rad to intake the cold air from below (Comes from Resiviour {Or the CPU}, Leaves to GPU)
-Now there will be hot air coming off that 480 on the bottom, so use the 2 slots on the other side of the bottom to Exhaust that hot air...
Ok and i ask one last question, is it wise to take the liquid from the CPU, Dump it into the Resiviour, or cool run it through a Rad THEN send it to the Resiviour? I feel like i should cool it first but... I dont know for sure.
Thanks Guys!
Liquid Cesium
So im planning on making a build using the massive case the 900D, i intend on having plenty of Graphics cards (EVGA GTX 770 4Gb SC) in Tri-SLI, and i will cool my i7 - 3930K. I intend to use XSPC parts for this build. However, while i do know a thing or two about LC, there seems to be a bit of mystery over Intake VS. Exhaust. One of the companies i read from suggested to use the top rad as intake in some cases, to cool the Mobo. Now i figure that could blow hot air back into the case. I do know that having a larger amount of intake VS exhaust is supposedly better to prevent "dead spots" of air in the case. I will be using AT LEAST 4 Fans on their own and have two fan loaded Rads (Perhaps a 360 on top and a 480 on bottom) and its possible ill use the 2 fans on the other side in the bottom as well.
What i was thinking:
-Use the top 360 (or max it to 480) Rad to exhaust the hot air (Comes from GPU, Leaves to CPU)
-Use the bottom 480 Rad to intake the cold air from below (Comes from Resiviour {Or the CPU}, Leaves to GPU)
-Now there will be hot air coming off that 480 on the bottom, so use the 2 slots on the other side of the bottom to Exhaust that hot air...
Ok and i ask one last question, is it wise to take the liquid from the CPU, Dump it into the Resiviour, or cool run it through a Rad THEN send it to the Resiviour? I feel like i should cool it first but... I dont know for sure.
Thanks Guys!
Liquid Cesium