Tom's Hardware Visits STMicroelectronics In Rennes, France
Tags:
-
Business Computing
-
Processors
Last response: in Reviews comments
Anonymous
June 19, 2014 11:59:43 PM
"French factory," they say, is almost an oxymoron. When was the last time you saw a news story about the success of a manufacturing plant in the land of Beaujolais and Brie? Our French team took a tour of STMicro's operation in Rennes and reports back.
Tom's Hardware Visits STMicroelectronics In Rennes, France : Read more
Tom's Hardware Visits STMicroelectronics In Rennes, France : Read more
More about : tom hardware visits stmicroelectronics rennes france
Scionyde
June 20, 2014 9:48:53 AM
"The poor overall economic picture and pessimistic approach newspapers like to take in speaking of the electronics industry in France would lead you to think that that scenario is utopian at best."
Maybe I'm missing something obvious, but isn't 'utopian' the exact opposite of the word you were intending to use there?
Maybe I'm missing something obvious, but isn't 'utopian' the exact opposite of the word you were intending to use there?
Score
1
vancedecker
June 20, 2014 12:49:52 PM
Related resources
blackmagnum
June 21, 2014 3:46:54 AM
army_ant7
June 21, 2014 11:45:26 PM
jasonelmore
June 22, 2014 12:31:45 AM
vaughn2k
June 22, 2014 10:54:40 PM
"Once the die is mounted in its case, the wires must be soldered to connect the chip and the pins. This operation can seem archaic compared with the processors used in PCs or smartphones, whose dies are connected via direct contact with bumps on their epoxy carriers." - The wire is not soldered to the pins but welded using an ultrasonic force + power - or Ultrasonic wirebonding. The head of the tool where the wire (either it is an Al or Au wire) comes out, generates this combination of ulrasonic energy to be able to connect the die pad and pins. If an Au wire is used, the process adds a thermal property, which is also called thermosonic bonding. CPU and smart phone chips (and virtually all chips) uses the same process. However, most assembly uses Au wire or Cu wire, instead of Al wire. Another process that is used o intorconnect chips to substrate is called flip-chip bonding, or soldering or ILB (inner lead bonding), and then going into the process of underfilling, to protect these interconnects.
Score
0
vaughn2k
June 22, 2014 11:02:02 PM
vaughn2k
June 23, 2014 1:11:51 AM
gotrek
June 23, 2014 6:57:56 AM
!
sorry for the double post..