nayrnayr1 :
Actually just not put lids on their k-series CPUs.
That would require them to redesign the socket hold down clamping mechanism to release exposed die CPUs or supply the heat spreader to the CPU for the present clamping mechanism separately packaged to avoid shipping damage, which would elevate their warranty responsibility to nightmarish levels.
Back in the day that we had exposed die CPUs we also had clamping mechanisms designed for those type mounting situations, so there is a whole lot more involved than releasing delidded CPUs to the mass public, of which only about 1% of the entire CPU sales are even overclockers.
You may as well face the fact you are in a minority no matter how many overclockers it appears to be out in the world, the massive sales of computers go to the overclocking clueless.
You can always delid yourself, but don't expect Intel to do it for you because of the factory parameters of even installing the heat spreader are more complicated than you realize, as there are specifications that are strictly adhered to like the amount of TIM vs the amount of rim sealing.
The heat spreader also does more than just spread the heat, it supplies the clamping contact points of the hold down mechanism, and it distributes the load across the CPU substrate so as not to bow or crack the substrate under cooler mounting pressure.
Your request to Intel is like Lancelot Link, "I laugh in your face!", which is probably the response Intel would be thinking, fully aware of all your request would entail.