finished lapping my Q6600 (with pics and results) - Page 3

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Oh rodney, you slay me!

Hmm.... well let me OC my cpu to 3.6 and see how hot it gets this weekend. I'll think about the lapping issue after that. Some before/after screen's would be helpful!

How do u sand the board? How did u get your hands in there?

[quotemsg=1752127,109,134604]wow.....

Um...

Wow....

[/quotemsg
thats hilarious

See class, THATS how you get a dead thread started again!

Had anybody consider that temp. decrese is due to less space between heat source and spreader and so it could be important to lap as deep as possible and not only to match two surfices???

be difficult as gpu is not mounted in a socket so how could you take it out and do what is described.

This thread inspired me to do the same with my E8400:

Started with 400 finished with 1000.

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Temps are about the same... But it's way hotter today compared to when I did the pre temps. Also I am hoping once the thermalgrease is broken in it will be a bit lower. 36c before and 36c after.

Hi,
This is my first post to the forum, great site people, keep up the great work and advice.

I want to comment on the Lapping subject.... The comment left by jimmm is correct (my opinion), when tightening down on the HS there is alway going to be a little flex, especially in the casing of the cpu due to the thiness in the casing of the cpu. Once tightened evenly the surface will flex (although you will not see it with the naked eye, it will flex) and will be very close if not almost perfect. Even after 1 month re tighten the screws again evenly and you will not need any lapping.

Take care all...and good luck.

Peace

Cavemen didnt have zippers

just to reassert what these guys are saying , it does work lapping cpu+heatsink , for comparison the ideal thing is a car engine , when manufactured they cast the engine block on mass to produce a good level of performance , it works fine and most people are happy with that , but for the odd few people you can 'gas flow the engine and skim the head increasing performance. this is exactly the same with the cpu and heatsink , there designed to a set target which pleases 90% of customers and serves its purpose , but for the odd few nutters like ourselfs , lapping them refines out the inconsistencys that manufacturing cant do cost effectively and gives you a boost.
p.s copper doesnt tend to oxidize much indoors like it does outside due to lower humidity , also AS5 if applyed properly will act as a barrier too.

re: the flexing:
I'm sure there is some insignificant amount of flexing, but over such a small area, its probably even less than surface irregularity after lapping.

re: the Cylon case:
good luck finding a steel case without plastic on it. you might have better luck with aluminum, but, I don't know if they plate differently.

I think you'll also have a tough time finding a case with a smooth enough surface to look good, even with a thick nickel layer.

might be better off with a SS Antec p182

No it will not 'hurt' the CPU, but may inhibit the heatsink's ability to transfer the heat (because of inpurities in the mating surface between the IHS and HSF. Use ArctiClean 1 & 2 after you're done with everything and your setup should work optimally.

Would lapping this heatsink be stupid...

http://www.frostytech.com/articlei [...] 3_base.jpg

I gave up on my Xiggy S1283 about 2 months ago and put this AC7 on. I just got back from Lowes and all they had (horrible selection) was 220 all purpose, 400 wetordry and 600 wetordry, I bought all 3 of those. I got home and checked the Xiggy with the razor blade and its preety bad, along the copper pipes its not THAT bad.....but across the pipes its horrible, the blade dosent even touch the pipes due to the aluminum pieces, its just not even close. Im gonna mess with it here soon, and maybe do my Q6600 afterwards. Like alot of other people mine appears to be preety concave/convex w/e. Cores 0 and 1 are 4-7c higher than 2 and 3 no matter what cooler I put on here.

I've lapped my CPU/HSF combo twice and both times ive only experienced a 1-3 degree diff. waste o time IMO.

Good points^^

Right now I'm pretty impressed!

Running 29C idle with all fans on low. Of course I have power plan on balanced so it's idling at 2.0Ghz. But I think 29C is pretty impressive for idle temps.

I used to do this with all my old CPU's, P400's, etc. used a copper heatsink and arctic silver. got some really good results. Might have to try this again when i get a new cpu and watercooling soon. not sure if it's worth it at the moment tho as i have dual 2Ghz clocked to 3.4 with air-cooling anyway and low temps (very lucky)
Vinceak - older dual cores aren't really stable over 55C i believe. newer ones can go a bit higher maybe 65C. I remember someone mentioning on another forum that the Q6660 would be ok somewhere around 100C! (referring to the datasheet) Wouldn't like to try it tho, and doubt it would boot

just wanted to know, as im newish to overclocking (my first overclocked machine)

My processor is running at 3.2g with multiplier 9 and Bus at 256,
Core voltage is set to 1.36 so if i lapped my processor and heat sink does this mean better contact between the 2 resulting in less heat and lower voltages??

In my experience it doesn't mean you can lower the voltage, but you can raise them with less ill effect

Of course, but you need a lot less.

Hi, i have just finshed lapping my q6600 & heat sink, and very satisfied with the result after putting it all together again with arctic silver thermal paste, and several hours of cpu burn in, checked the temperatures with realtemp, coretemp, occt and speedfan and found that the temperatures had dropped by 10c.

My setup

CPU----------------Intel core2 quad Q6600 @2.4GHz overclock to 3.6GHz
Motherboard-----P5Q
Ram----------------Corsair XMS2 Dominator 2GB
Case---------------Thermaltake Armor LCS VE2000BWS
PSU-----------------Jeantech Storm 700W Sli/Cross-fire
GPU-----------------Nvidia Geforce 9400 GT


Temp Before lapping idle 37c,34c,33c,32c
Temp Before lapping, running intelburn test 82c,82c,79c,79c

intelburn test setting

Turn on error detection (y/n) Y
Stress levels 1
Enter number of time to run the test 6
PC passed this test several times

Temperature on start up this morning at 07.45 were 30c,25c,25c,25c, after leaving the pc idle for about an hour temperatures were 33c,30c.30c,30c

Idle temp after lapping are 33c,30c,30c,30c
Idle temp after runing the above test again were 72c,72c,68c,68c

so not a bad result i think, would like some input or comments on this from other overclockers

That's what I was thinking. I've got a Phenom II, but looks like our skin would be squished on the pins if we were holding them like Intel owners do. LGA775 has little bumpy things that don't get in the way of hands, lucky Intel >.> I'm gonna get an old e63 for $35 and OC the poop outa it.

Alright, I'm going to try and lap my P4 next weekend. Is there any chance somebody with girly fingers could avoid touching the pins entirely?

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