Here's a new embedded APU from AMD that will enable fanless devices.
AMD revealed on Tuesday a new low-powered APU for its AMD G-Series family, the GX-210JA. The new SoC has a maximum thermal design power (TDP) envelope of 6 watts, and an expected average power usage of approximately 3 watts.
The company's G-Series is billed as the next evolution in embedded technology, combining a low-power CPU, advanced GPU and an I/O controller onto a single chip. AMD said this new addition will enable even more fanless designs for a variety of applications including digital gaming, medical imaging and loads more.
"AMD Embedded G-Series SOC products offer unparalleled compute, graphics and I/O integration, resulting in fewer board components, low-power use, and reduced complexity and overhead cost," said Arun Iyengar, vice president and general manager, AMD Embedded Systems.
The new G-Series chip features two CPU cores clocked at 1.0 GHz, and a Radeon HD 8180 graphics core clocked at 225 MHz. It follows the GX-210HA chip which has a TDP of 9 watts, two CPU cores clocked at 1.0 GHz, and a Radeon HD 8210E graphics core clocked at 300 MHz.
"The advance of APU processor design, the Surround Computing era, and The Internet of Things has created the demand for embedded devices that are low power but also offer excellent compute and graphics performance," Iyengar added.
The G-Series family features four additional APUs including the quad-core GX-420CA with Radeon HD 8400E graphics, the quad-core GX-415GA with Radeon HD 8330E graphics, the dual-core GX-217GA with Radeon HD 8280E graphics, and the quad-core GX-416RA chip that doesn't have a GPU. TDPs range from 15 watts to 25 watts.
AMD said the G-Series APUs feature enterprise-class error-correction code (ECC) memory support, and an industrial temperature range of -40°C to +85°C. The entire AMD Embedded G-Series SOC platform, including the new GX-210JA chip, is currently shipping.