Ads

Best offers

Ads
All about Miscellaneous
 Latest Miscellaneous articles
Exclusive Interview: Nvidia's Ian Buck Talks GPGPU

Exclusive Interview: Nvidia's Ian Buck Talks GPGPU
With Snow Leopard and Windows 7 both offering GPGPU capabilities, we wanted to talk to Nvidia's Ian Buck. Not only is he one of the fathers of Brook, the programming language ultimately adopted by AMD/ATI, but the head of Nvidia's CUDA group as well. Read More

  • Beamforming: The Best WiFi You’ve Never Seen
    Forget 802.11n Draft 2.0. The future of video-capable WiFi depends on a signal-boosting technique called beamforming. We put the pioneers in this frontier through some real-world testing to find out which technology is going to change the wireless world. Read More
All Miscellaneous articles

Newsletters


  • Ask your question about IT issues
  • Post

Partners

The Games selection

adventure : Ray Adventure game, South Park style. Pick the way the story goes by picking an answer among those offered.
crazy : Interactive Boogy Pick one of the 3 songs, hit on the correct keys matching this boy's dance moves.
Ads

Sponsored links

Infineon samples dual-die, 4 GByte DDR2 memory

Next news
12:11 PM - February 25, 2005 by Wolfgang Gruener

Munich - The integration of two core elements does not only benefit processors: Infineon claims it has developed the first dual-die DDR2 memory module to double overall capacity while increasing total height of the device by only 0.1 mm.

The new modules are based on eighteen 2 Gbit DDR2 components, which are created by stacking two 1 Gbit DDR2 SDRAMs. This dual-die approach allowed Infineon to double the current maximum DDR2 capacity from 2 GByte to 4 GByte.

The dual-die solution increases the height of the module only by the thickness of a sheet of letter paper or 0.1 mm for a total device height of 4.1 mm - which is about 40 percent less than the requirements set by the Joint Electronic Device Engineering Council (JEDEC).

According to Infineon spokeswoman Karin Braeckle, the 4 GByte modules are sampling now and are available in DDR2-400 and DDR2-533 speeds. Because of their compact size, the devices are targeting high-density servers in the low-end and midrange segment that now can pack four 4 GByte modules for a total of 16 GByte in one system. Down the road, Infineon sees the dual-die technology to move also into SO-DIMMs for Notebooks and increase DDR2 module capacity to 8 GByte by stacking 2 Gbit DDR2 SDRAMs.

The 4 GByte modules are currently available in sample quantities for $3900 per unit. Volume production will begin this summer, according to Braeckle.

Source : Tom's Hardware US

Talkback
Add your comment
Comments are closed on this page.

Sponsored links