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PBGA substrate shortage may disrupt SiS and VIA chipset shipments
9:34 AM - September 6, 2005 by
Wolfgang Gruener
Source: Tom's Hardware US – Category : Miscellaneous 0 comment
Source: Tom's Hardware US – Category : Miscellaneous 0 comment
Because supplies of plastic ball-grid array (PBGA) substrates will continue to be short of demand throughout the end of this year, Taiwan chipset makers Silicon Integrated Systems (SiS) and VIA Technologies may face difficulties in fulfilling large entry-level chipset orders in the third quarter, according to sources in the Taiwan substrate industry.
More here at DigiTimes .
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- Tight PDP supply expected for 4Q
- Packaging and testing outlook bright as demand picks up