Pure Carbon Could Solve All Your Heat Disspipation Worries
There is hope for a future in which computing devices could, theoretically, operate without the need for elaborate cooling techniques.
Researchers at the University of Texas at Austin said that a new form of graphene could essentially prevent laptops and other electronics from overheating and enable chip companies and device manufacturers to pack much more powerful chips into mobile devices.
Graphene, an atom-thick layer of carbon, typically consists of 98.9 percent 12C (carbon) and 1.1 percent 13C, but the graphene created by the University of Texas at Austin scientists represents 99.9 percent 12C and isotopically pure carbon. In their experiments, the material was 60 percent more effective at managing and transferring heat than normal graphene, the scientists said.
"This demonstration brings graphene a step closer to being used as a conductor for managing heat in a variety of devices. The potential of this material, and its promise for the electronic industry, is very exciting," said Rodney Ruoff, a physical chemist at the University's Cockrell School.
"Because self-heating of fast and densely packed devices deteriorates their performance, graphene's ability to conduct heat well will be very helpful in improving them," added Alexander Balandin, a professor of Electrical Engineering, chair of Materials Science and Engineering at the University of California Riverside and a corresponding author of the research paper published in the journal Nature Materials.
"Initially, graphene would likely be used in some niche applications, such as thermal interface materials for chip packaging or transparent electrodes in photovoltaic solar cells or flexible displays," he continued. "But, in a few years, the uses of graphene will be diverse, broad and far-reaching because the excellent heat conduction properties of this material are beneficial for all its proposed electronic applications."
Then again, we'll find a way to necessitate a bulky air/water setup even with grahpene...
Stupidest comment of the month.
Then again, we'll find a way to necessitate a bulky air/water setup even with grahpene...
It also seems the days of the silicon wafer are numbered.
Carbon dioxide is very different from grapheme. CO2- trap heat vs graphene- good conductor.
It's been well known in materials science and engineering circles for years that diamond, aka carbon, is the best heat conductor known. What makes diamond unusual is that it's a great electrical insulator while being a great heat conductor (this is counter-intuitive as good heat conductivity and good electrical conductivity go hand in hand, except with carbon).
The whole reason we don't have diamon heat sinks is because of the diamond consortiums like De Biers. Artificial diamond is indistiguishable from natural diamond when grown properly (and GE knows how to do it). As such, the diamond consortiums have leaned hard on the producers of artificial diamonds. One can only hope that this changes.
Stupidest comment of the month.
I see this to be less useful in mobile devices than in OC'd systems where people are trying to max out their system performance. Not that I am saying it is useless in laptops and tablets since it obviously isn't.
The problem is that graphene isn't stiff, it's like super flexible paper that's tougher than steel. You'd have to stretch it over a frame. That would also be a problem since there has to be a way to connect the case to the components for proper cooling.
device manufacturers to pack much more powerful chips into mobile devices."
Not without a fan that has a good air supply. Like say a laptop that just has 1 suction vent and you put in on your bed....
in all honesty when Graphene is finalized and it is actually put out of the consumer products, you probably won't be able overclocked it. I remember reading about how Graphene is able to handle speeds that come close to light.
Copper has 480
Graphene is between 4000 to 5000
It figures...