Called EX20000C, the sheet was shown at Techno-Frontier 2012 in Tokyo last week, where the paste kept a CPU at a stable 53 degrees Celsius, and the thermal sheet kept it at 50 degrees Celsius. There was no information on the processor used in the demonstration.
According to Sony, the sheet is between 0.3 and 2.0mm thick and features a thermal resistance of 0.4-0.2K·cm2/W. Sony has offered thermal pads for some time, such as the EX50000, which, however, cannot match the performance of thermal paste.
"The EX20000C is the first sheet that has such a low thermal resistance," the company said, according to an article published by Tech-On.
There was no information when the EX20000C could become commercially available.