Sources claim Samsung to establish BGA substrate plant in Suzhou
News
published
Samsung Electro-Mechanics will start volume shipping ball-grid array (BGA) substrate from a plant in Suzhou starting in mid 2006 for packaging Samsung DDR2 memory, according to industry sources. Local BGA substrate makers are not concerned about Samsung's supposed move, claiming the potential impact would be limited.
More here at DigiTimes.
Stay on the Cutting Edge
Join the experts who read Tom's Hardware for the inside track on enthusiast PC tech news — and have for over 25 years. We'll send breaking news and in-depth reviews of CPUs, GPUs, AI, maker hardware and more straight to your inbox.
More about manufacturing
No comments yet
Comment from the forums