UMC to Deliver 20 nm Chips in H2 2013

He expects a "structural shift", according to Digitimes, that will lead to a gradual change in market leadership.

Sun sees UMC well-positioned with new 300 mm production capacities coming online in 2013. The company is investing about $2 billion into its fabs this year, which mainly will be used to grow 28 nm capacity. Sun estimated that about 5 percent of UMC's 2012 revenues will be derived from 28 nm products.

20nm FinFET is scheduled for a 2014 volume production and the company said that it has an agreement with IBM to develop a 20 nm 3D FinFET production technology. Low-volume 20 nm chips will be coming off the production lines in H2 2013, Sun said.

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  • shin0bi272
    I have to ask... why they are still using round wafers to make square chips? You'd think that someone would have come up with a way to mass produce chips 1 at a time via some sort of assembly line process. If it works for food, light bulbs, cars, dishware, etc., etc., it should work for chips too. Eh anyway Im sure someone will figure it out some day.
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  • blazorthon
    shin0bi272I have to ask... why they are still using round wafers to make square chips? You'd think that someone would have come up with a way to mass produce chips 1 at a time via some sort of assembly line process. If it works for food, light bulbs, cars, dishware, etc., etc., it should work for chips too. Eh anyway Im sure someone will figure it out some day.


    Making larger wafers are generally cheaper per chip produced than making smaller wafers if I remember correctly. Round ones are probably much easier to make than square ones.
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  • gilgamex
    I think it's because the wafer is spun through all sorts of production phases, the circular shape of it allows the aerodynamics of it to be consistent leaving little margin for error.
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