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TSMC preps immersion lithography for sub-22nm wafer production
January 16, 2006 – 1:30 PM
Having already commenced pilot runs on 65nm wafer production since last year, Taiwan Semiconductor Manufacturing Company (TSMC) is now readying immersion lithography for 22nm production, according to Burn Lin, director of lithography R&D at TSMC.
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The IP Communications High Density Digital Voice Network Module (NM-HDV2-1T1/E1) is for use with Cisco 2600XM, 2691 and 3700 Multiservice Access...
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- 08-20-2008 at 08:08 AM - IBM and partners including AMD first to 22nm
- 12-07-2006 at 08:53 PM - Update: Intel testing 32nm, 22nm 2015?
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