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Windows Embedded CE 6.0 applications to hit market in Q4
November 3, 2006 – 11:05 AM
After Microsoft rolled out its Windows Embedded CE 6.0 operating system (OS) for embedded systems on November 1, the company said the OS has already been adopted by numerous makers with end products to hit the market in the fourth quarter.
Players in the embedded market see opportunity for x86 system-on-chip
February 9, 2007 – 12:09 PM
Major chipset makers such as Intel, AMD and VIA have begun to target the x86 based system-on-chip (SoC) market, according to sources from embedded platform makers.
AMD expected to post 20% share of embedded processor market in 2007
February 7, 2007 – 12:08 PM
Even though Intel currently has a 70% share of the x86 embedded processor market, AMD is expected to raise its market share in the sector to over 20% in 2007 after it has begun adding dual-core processors to it's embedded processor lineup, according to Taiwan-based IPC makers.
Intel dual-core embedded platform to extend applications for industrial PCs
February 16, 2006 – 10:58 AM
The availability of Intel's Core Duo dual-core x86 embedded platform will help expand industrial PC (IPC) applications and improve related technologies to the point where they can compete with current PC performance, according to Taiwan-based IPC specialists.
DFI to include AMD embedded processors
March 12, 2007 – 1:14 PM
Taiwan-based industrial PC (IPC) maker Diamond Flower Electric Instrument (DFI) plans to add AMD embedded processors in its product lineup later in the year, according to sources at the company. Aside from Advantech and ICP Electronics, which already include AMD processors in their lineup, DFI also plans to use AMD processors in its IPC products starting from the third quarter of this year with a focus on the Micro ATX platform.

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CES 2007: Toshiba offering four embedded NAND flash solutions
January 9, 2007 – 10:29 AM
Toshiba America Electronic Components (TAEC) announced at CES 2007 that it is offering a selection of four embedded NAND solutions developed by Toshiba: GB NAND, LBA-NAND, GB MCP and Package-on-Package (PoP).

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