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  • ASML pushes EUV for sub 22 nm lithography
    September 13, 2006 – 11:00 AM
    ASML has reiterated its positive outlook for extreme ultraviolet (EUV) as the mainstream lithography light source when going to deep submicron production while its closely-tied pure-play foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) said it is happy to see multiple choices for light sources at the deep submicron level, according to company executives during the ongoing SEMICON Taiwan 2006 show.
  • Intel and Corning to develop EUV photomask substrates for 32 nm production
    July 6, 2005 – 4:20 PM
    Intel has entered a joint development agreement with Corning to develop ultra low thermal expansion (ULE) glass photomask substrates required for Extreme Ultraviolet (EUV) lithography and semiconductors with transistor structures smaller than 40 nm.
  • AMD Reports Successful Production Of Full-field EUV Test Chip
    February 26, 2008 – 2:21 PM
    Researchers from AMD and IBM apparently have reached a milestone in advancing chip production technology, creating a path to semiconductors with structures of 16 nm and smaller.
  • IBM drives chipmaking process beyond current limitations
    February 21, 2006 – 6:19 PM
    IBM researchers claim to have found a way to use deep-ultraviolet (DUV) lithography techniques for the production of 32 nm chips and smaller. The limits of DUV have been pushed out several times and saved chip builders from a costly switch to an extreme ultraviolet (EUV) process so far. IBM's discovery could delay the transition for at least one more product generation.

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