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TOM'S HARDWARE GUIDE > packaging

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News

Intel said to be releasing northbridge packaging and testing orders
March 24, 2006 – 11:37 AM
Intel is in talks with top packaging and testing houses over outsourcing the back-end production of its northbridge chips, according to industry sources.
Packaging and testing outlook bright as demand picks up
September 5, 2005 – 11:13 AM
Thanks to the upcoming hot season for the packaging and testing industry, sales from Taiwan's Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are likely to increase 10-20% sequentially this quarter and continue to rise in the fourth quarter, according to Joseph HS Tung, CFO and vice president of ASE and SPIL chairman Bough Lin.
Northbridge migration from PBGA to FC packages on hold until cost drops
May 19, 2006 – 12:50 PM
The migration from plastic ball-grid array (PBGA) to flip-chip (FC) packaging for northbridge chips will not proceed much further this year, as VIA Technologies, ATI Technologies and Nvidia will continue using PBGA packaging for their solutions, according to industry sources.
Taiwan DRAM back-end firms ramping DDR2 packaging capacity
February 2, 2005 – 10:58 AM
DRAM back-end firms in Taiwan are ramping their DDR2 packaging capacity to a level where they can handle the accelerating conversion from DDR to DDR2, according to sources.