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TSMC to charge premium for making chips outside of Taiwan, including its new US fabs, CEO says
By Anton Shilov published
TSMC's production services in the U.S., Japan, and Germany will be more expensive than the same manufacturing services in Taiwan, says company.
'World's smallest' Wii is the size of a deck of cards, uses custom PCBs
By Christopher Harper published
A Nintendo Wii is successfully converted into the size of a deck of playing cards, and how to do it yourself is shared on GitHub.
EK's new custom waterblocks help cool delidded AMD Ryzen AM5 CPUs
By Anton Shilov published
EKWB launches waterblock for custom cooling system for delidded AM5 CPUs, including X3D CPUs.
Ubuntu outperforms Windows 11 on the Framework Laptop 16 with Ryzen 7 7840HS
By Aaron Klotz published
Phoronix tested two versions of Ubuntu Linux against Windows 11 on the latest Ryzen-powered Framework 16 laptop and discovered that Ubuntu is better performing OS most of the time.
RAM Benchmark Hierarchy: DDR5, DDR4 for AMD, Intel CPUs
By Zhiye Liu last updated
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
Leak reveals 500W fire-breathing 128-core Granite Rapids Xeon 6 CPU
By Aaron Klotz published
Intel is upping core counts, but also increasing TDP
Micron to get $6 billion from U.S. gov't to build memory fabs: Report
By Anton Shilov published
U.S. government to support Micron's EUV DRAM fab, other fab projects in the U.S. with $6 billion according to Bloomberg.
Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025
By Paul Alcorn published
Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.
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