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                    <title><![CDATA[ Latest from Tom's Hardware in Asml ]]></title>
                <link>https://www.tomshardware.com/tag/asml</link>
        <description><![CDATA[ All the latest asml content from the Tom's Hardware team ]]></description>
                                    <lastBuildDate>Tue, 24 Mar 2026 16:38:01 +0000</lastBuildDate>
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                                                            <title><![CDATA[ SK hynix places record $8 billion order for ASML EUV lithography machines — should pay for up to 30 EUV machines over two years, serving HBM and advanced DRAM production ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-places-record-8-billion-order-for-asml-euv-lithography-machines</link>
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                            <![CDATA[ SK hynix disclosed in a regulatory filing on Tuesday that it will purchase 11.9 trillion won ($7.9 billion) worth of EUV lithography equipment from ASML. ]]>
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                                                                        <pubDate>Tue, 24 Mar 2026 16:38:01 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/NzktnSTcWDJPvdfKLwMi9F-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / Bloomberg]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK hynix]]></media:description>                                                            <media:text><![CDATA[SK hynix]]></media:text>
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                                                            <title><![CDATA[ 'Silicon' is a new five-pound art book charting the semiconductor revolution with full-page die shots and commentary — 384 page tome is $99 to pre-order now ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/silicon-is-a-new-five-pound-art-book-charting-the-semiconductor-revolution-with-full-page-die-shots-and-commentary-384-page-tome-is-usd99-to-pre-order-now</link>
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                            <![CDATA[ Silicon, Arena’s stylish and premium “coffee table book like no other,” is up for pre-order now priced at $99. ]]>
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                                                                        <pubDate>Sun, 22 Mar 2026 12:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/KCXJiXMNkv46M7ty4Dy7HT-1280-80.jpg">
                                                            <media:credit><![CDATA[Arena Magazine]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Silicon]]></media:description>                                                            <media:text><![CDATA[Silicon]]></media:text>
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                                                            <title><![CDATA[ ASML workers still in the dark seven weeks after 1,700 management cuts announced — cuts represent 4% of its global workforce ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-workers-still-in-the-dark-seven-weeks-after-1700-management-cuts-announced</link>
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                            <![CDATA[ The prolonged uncertainty is generating internal unrest, according to an ASML spokesperson who spoke to Dutch broadcaster Omroep Brabant. ]]>
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                                                                        <pubDate>Sun, 15 Mar 2026 13:50:00 +0000</pubDate>                                                                                                                                <updated>Sun, 15 Mar 2026 13:54:19 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EGXamcWxVuFiTc6pCbeE25-1280-80.jpg">
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                                                            <title><![CDATA[ ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-makes-breakthrough-in-euv-chipmaking-tech-plans-to-increase-speed-by-50-percent-by-2030-new-1-000-watt-light-source-fires-three-lasers-at-100-000-tin-droplets-every-second</link>
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                            <![CDATA[ ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond. ]]>
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                                                                        <pubDate>Tue, 24 Feb 2026 12:01:57 +0000</pubDate>                                                                                                                                <updated>Wed, 25 Feb 2026 10:24:40 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/MqQcLuXtcS9FPhQiZeDavC-1280-80.jpg">
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                                                            <title><![CDATA[ U.S. lawmakers demand sales ban on chipmaking tools to China — bipartisan group targets ASML's Dutch exports of lithography machines used to create advanced chips ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/u-s-lawmakers-demand-sales-ban-on-chipmaking-tools-to-china-bipartisan-group-targets-asmls-dutch-exports-of-lithography-machines-used-to-create-advanced-chips</link>
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                            <![CDATA[ Bipartisan group of lawmakers want the U.S. government to impose export controls on all wafer fab equipment bound to China except those that can be made locally and make allies do the following. ]]>
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                                                                        <pubDate>Thu, 12 Feb 2026 10:50:03 +0000</pubDate>                                                                                                                                <updated>Thu, 12 Feb 2026 18:08:06 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/yQaGAkqxhQh83Cd9CuzDWg-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC]]></media:credit>
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                                                            <title><![CDATA[ ASML projects $71 billion in revenue by 2030, as demand for EUV lithography machines intensifies due to AI boom — China sales lag behind while company cashes in on high-end Twinscan systems ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-projects-usd71-billion-in-revenue-by-2030-as-demand-for-euv-lithography-machines-intensifies-due-to-ai-boom-china-sales-lag-behind-while-company-cashes-in-on-high-end-twinscan-systems</link>
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                            <![CDATA[ ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records. ]]>
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                                                                        <pubDate>Thu, 29 Jan 2026 12:39:22 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EGXamcWxVuFiTc6pCbeE25-1280-80.jpg">
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                                                            <title><![CDATA[ Despite AI chip boom and record high stock price, ASML to lay off employees — company to streamline IT and Technology departments, proposed cuts mostly affect leadership roles ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-to-lay-off-employees-despite-ai-chip-boom-and-record-high-stock-price-company-to-streamline-it-and-technology-departments-proposed-cuts-mostly-affect-leadership-roles</link>
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                            <![CDATA[ ASML announced that it's cutting around 1,700 positions — mostly at the leadership level — to streamline its operations. Its Technology and IT & Data organizations will be hardest hit by the planned layoffs. ]]>
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                                                                        <pubDate>Wed, 28 Jan 2026 15:15:30 +0000</pubDate>                                                                                                                                <updated>Wed, 28 Jan 2026 15:35:22 +0000</updated>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EGXamcWxVuFiTc6pCbeE25-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ China tells chipmakers to use homegrown chipmaking tools for 50% of new capacity — decree designed to squeeze foreign suppliers out of supply chain ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-tells-chipmakers-to-use-homegrown-chipmaking-tools-for-50-percent-of-new-capacity-decree-designed-to-squeeze-foreign-suppliers-out-of-supply-chain</link>
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                            <![CDATA[ China has quietly mandated that at least 50% of equipment used for new semiconductor capacity be domestically sourced. However, as China's industry cannot produce enough lithography tools, authorities tend to get flexible and allow foreign alternatives in. ]]>
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                                                                        <pubDate>Tue, 30 Dec 2025 13:52:56 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/mdz7qf5MJxJErvWyTkAEQa-1280-80.png">
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                                                            <title><![CDATA[ China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip — sanctions-busting experiment is still years away from becoming operational ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/chinas-reverse-engineered-frankenstein-euv-chipmaking-tool-hasnt-produced-a-single-chip-sanctions-busting-experiment-is-still-years-away-from-becoming-operational</link>
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                            <![CDATA[ A reported attempt by a covert Chinese lab to reverse-engineer an EUV lithography scanner underscores that, despite access to scattered components, replicating ASML's EUV tools is effectively impossible without recreating the company's entire global supply chain, optics ecosystem, and proprietary software built over decades. ]]>
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                                                                        <pubDate>Wed, 24 Dec 2025 14:20:22 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/VeUsd9vM4WBszDumWSs7gJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Surprising biomedical application found for ASML’s chipmaking EUV lithography machines — they can mass produce nanopores for molecular sensing ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/surprising-biomedical-application-found-for-asmls-chipmaking-euv-lithography-machines-they-can-mass-produce-nanopores-for-molecular-sensing</link>
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                            <![CDATA[ IMEC has successfully demonstrated the full wafer-scale fabrication of nanopores using ASML’s state-of-the-art extreme ultraviolet (EUV) machines. ]]>
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                                                                        <pubDate>Sun, 21 Dec 2025 16:34:27 +0000</pubDate>                                                                                                                                <updated>Mon, 22 Dec 2025 12:17:42 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/Q5DB3YhU9neKginm7VM5gd-1280-80.jpg">
                                                            <media:credit><![CDATA[IMEC]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Nanopores]]></media:description>                                                            <media:text><![CDATA[Nanopores]]></media:text>
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                                                            <title><![CDATA[ China may have reverse engineered EUV lithography tool in covert lab, report claims — employees given fake IDs to avoid secret project being detected, prototypes expected in 2028 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-may-have-reverse-engineered-euv-lithography-tool-in-covert-lab-report-claims-employees-given-fake-ids-to-avoid-secret-project-being-detected-prototypes-expected-in-2028</link>
                                                                            <description>
                            <![CDATA[ China has reportedly built and begun testing a secret EUV lithography prototype using ASML-style laser-produced plasma technology. Yet, despite generating 13.5-nm light, the system remains unable to make chips and appears to be years away from achieving a complete, production-ready EUV manufacturing capability. ]]>
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                                                                        <pubDate>Thu, 18 Dec 2025 11:40:45 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PQuTVKz3fP2hiK4DF7jvVJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
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                                                            <title><![CDATA[ Intel installs industry's first commercial High-NA EUV lithography tool — ASML Twinscan EXE:5200B sets the stage for 14A ]]></title>
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                            <![CDATA[ Intel has installed and qualified ASML's TWINSCAN EXE:5200B, the first High-NA EUV lithography tool designed for commercial production, reiterating Intel's plans to use High-NA EUV patterning for 14A process technology and onwards. ]]>
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                                                                        <pubDate>Wed, 17 Dec 2025 12:25:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
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                                                            <title><![CDATA[ ASML under fire for selling DUV equipment to Chinese firm with military ties, says the machines are not subject to export controls — fears grow that 'old technology' will bolster Beijing's quantum effort ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-under-fire-for-selling-duv-equipment-to-chinese-firm-with-military-ties-says-the-machines-are-not-subject-to-export-controls-fears-grow-that-old-technology-will-bolster-beijings-quantum-effort</link>
                                                                            <description>
                            <![CDATA[ Dutch chip manufacturing design firm, ASML, has been accused of selling chip fabrication hardware to a Chinese defence firm tied to the ruling party. Although it claims the technology was old, it has raised concerns over its potential use in developing new quantum technologies, particularly with military applications. ]]>
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                                                                        <pubDate>Tue, 09 Dec 2025 12:39:36 +0000</pubDate>                                                                                                                                <updated>Tue, 09 Dec 2025 19:38:56 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Jon Martindale ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/QuoAVbw2s93FjLJ78PgitR-1280-80.jpg">
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                                                            <title><![CDATA[ ASML allegedly offered to spy on China for the US — company proposed being 'Washington’s eyes and ears in China' after breaking gentlemen’s agreement on limiting DUV sales to country, says new book ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/big-tech/asml-allegedly-offered-to-spy-on-china-for-the-us-company-proposed-being-washingtons-eyes-and-ears-in-china-after-breaking-gentlemens-agreement-on-limiting-duv-sales-to-country-says-new-book</link>
                                                                            <description>
                            <![CDATA[ ASML allegedly offered to spy on its customers for the U.S. after it was caught breaking a gentleman's agreement that limited the number of DUV lithography machines it could sell to China. ]]>
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                                                                        <pubDate>Sun, 23 Nov 2025 13:25:00 +0000</pubDate>                                                                                                                                <updated>Sun, 23 Nov 2025 16:52:46 +0000</updated>
                                                                                                                                            <category><![CDATA[Big Tech]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pzamkiuguieyRnBYqYYHkW-1280-80.jpg">
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                                                            <title><![CDATA[ Chinese scientists discover method to cut defects by 99% with DUV chipmaking equipment, but it destroys EUV pattern fidelity — analyzing photoresist clustering with cryo-ET at 105°C  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/chinese-scientists-discover-method-to-cut-defects-by-99-percent-with-duv-chipmaking-equipment-but-it-destroys-euv-pattern-fidelity-analyzing-photoresist-clustering-with-cryo-et-at-105-c</link>
                                                                            <description>
                            <![CDATA[ Chinese researchers have visualized how photoresist polymers cluster during development using cryogenic electron tomography and found that slightly raising post-exposure bake temperature could reduce defect density, but the finding has limited practical impact since this temperature is already typical for DUV processes and unsuitable for EUV lithography, where it would harm resolution and yield. ]]>
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                                                                        <pubDate>Mon, 10 Nov 2025 19:55:18 +0000</pubDate>                                                                                                                                <updated>Mon, 10 Nov 2025 19:55:22 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/RDRDxfSMpnNVf6QfdZd63b-1280-80.png">
                                                            <media:credit><![CDATA[GlobalFoundries]]></media:credit>
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                                                            <title><![CDATA[ American startup Substrate promises 2nm-class chipmaking with particle accelerators, at a tenth of the cost of EUV —  X-ray lithography system has potential to surpass ASML's EUV scanners ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/american-startup-substrate-promises-2nm-class-chipmaking-with-particle-accelerators-at-a-tenth-of-the-cost-of-euv-x-ray-lithography-system-has-potential-to-surpass-asmls-euv-scanners</link>
                                                                            <description>
                            <![CDATA[ A U.S. startup is developing a compact particle-accelerator-based X-ray lithography system that could surpass ASML's EUV scanners in resolution and cut wafer costs tenfold by the end of the decade, but its plan to build its own fabs rather than sell tools means it must reinvent the entire semiconductor production supply chain from the ground up. ]]>
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                                                                        <pubDate>Fri, 31 Oct 2025 15:43:06 +0000</pubDate>                                                                                                                                <updated>Fri, 31 Oct 2025 19:10:12 +0000</updated>
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                                                    <category><![CDATA[Tech Industry]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/RsQrx3Du6DkXezDVZ8fVsb-1280-80.png">
                                                            <media:credit><![CDATA[GlobalFoundries]]></media:credit>
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                                                            <title><![CDATA[ ASML launches revolutionary lithography scanner for advanced 3D chip packaging  — Twinscan XT:260 machine quadruples throughput ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-launches-revolutionary-lithography-scanner-for-advanced-3d-packaging-twinscan-xt-360-machine-quadruples-throughput</link>
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                            <![CDATA[ ASML has introduced the Twinscan XT:260, the industry's first lithography scanner designed specifically for advanced 3D packaging, wedding front-end precision with back-end productivity to quadruple throughput, marking a new era of tools purpose-built for heterogeneous integration. ]]>
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                                                                        <pubDate>Tue, 21 Oct 2025 02:19:03 +0000</pubDate>                                                                                                                                <updated>Tue, 21 Oct 2025 12:24:16 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/8eCnfLfJ5P9sFaUFPBmbd-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
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                                                            <title><![CDATA[ ASML is prepared for China's rare-earth export controls — finance head says company has stock thanks to long lead times ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-is-prepared-for-chinas-rare-earth-export-controls-finance-head-says-company-has-stock-thanks-to-long-lead-times</link>
                                                                            <description>
                            <![CDATA[ ASML's finance head, Roger Dassen, said the company has sufficient rare-earth reserves to keep production running despite China's new export-control regime that kicks in on December 1 and can halt shipments of rare earth materials across the world. ]]>
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                                                                        <pubDate>Wed, 15 Oct 2025 13:38:40 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EGXamcWxVuFiTc6pCbeE25-1280-80.jpg">
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                                                            <title><![CDATA[ China bets on DUV as EUV blockade reshapes chipmaking — but it won't dethrone ASML's advanced lithography, for now ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-bets-on-duv-as-euv-blockade-reshapes-chipmaking</link>
                                                                            <description>
                            <![CDATA[ U.S. pressure has cut China off from ASML’s EUV tools, forcing SMIC and peers to stretch DUV and build local scanners. It may be costly now, but it could be key to the country's road to self-reliance in semiconductor manufacturing. ]]>
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                                                                        <pubDate>Mon, 22 Sep 2025 15:34:28 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ lukejamesalden@gmail.com (Luke James) ]]></author>                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
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                                                            <title><![CDATA[ How TSMC managed to increase efficiency of ASML's EUV tools: System-level optimizations and in-house pellicles —chipmaker boosted EUV-driven wafer production by 30x over six years while reducing power consumption by 24% ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/how-tsmc-managed-to-increase-efficiency-of-asmls-euv-tools-system-level-optimizations-and-in-house-pellicles-chipmaker-boosted-euv-driven-wafer-production-by-30x-over-six-years-while-reducing-power-consumption-by-24-percent</link>
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                            <![CDATA[ TSMC has dramatically boosted EUV scanner throughput, pellicle performance, and energy efficiency through deep in-house innovations. ]]>
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                                                                        <pubDate>Wed, 17 Sep 2025 11:10:06 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/jxkTQmMET8rduWfUZgafWM-1280-80.jpg">
                                                            <media:credit><![CDATA[Taiwan Semiconductor Manufacturing Co., Ltd.]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[TSMC Lobby]]></media:description>                                                            <media:text><![CDATA[TSMC Lobby]]></media:text>
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                                                            <title><![CDATA[ ASML makes $1.5 billion investment in Mistral AI — ASML becomes the largest shareholder for the French AI start-up ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-makes-usd1-5billion-investment-in-mistral-ai-asml-becomes-the-largest-shareholder-for-the-french-ai-start-up</link>
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                            <![CDATA[ ASML has invested €1.3 billion in s Mistral AI allegedly in a strategic move to deepen its use of AI across lithography and chipmaking software. ]]>
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                                                                        <pubDate>Tue, 09 Sep 2025 10:22:01 +0000</pubDate>                                                                                                                                <updated>Tue, 09 Sep 2025 13:05:20 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EGXamcWxVuFiTc6pCbeE25-1280-80.jpg">
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                                                            <title><![CDATA[ China injects tens of billions of dollars in chipmaking tools, but it's easily more than a decade behind the market leaders — Here's why ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-injects-tens-of-billions-of-dollars-in-chipmaking-tools-but-its-easily-more-than-a-decade-behind-the-market-leaders-heres-why</link>
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                            <![CDATA[ China’s chip industry excels at mature nodes but remains at least a decade behind in advanced lithography. ]]>
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                                                                        <pubDate>Thu, 04 Sep 2025 16:06:46 +0000</pubDate>                                                                                                                                <updated>Mon, 08 Sep 2025 14:14:38 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/MqQcLuXtcS9FPhQiZeDavC-1280-80.jpg">
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                                                            <title><![CDATA[ ASML and SK hynix assemble industry-first 'commercial' High-NA EUV system at fab in South Korea ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-and-sk-hynix-assemble-industry-first-commercial-high-na-euv-system-at-fab-in-south-korea</link>
                                                                            <description>
                            <![CDATA[ SK hynix is the first memory maker to assemble ASML's High-NA EUV lithography system NXE:5200B at its M16 fab in Icheon to use it for R&D of next-generation process technologies before transitioning to full High-NA-based production later this decade. ]]>
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                                                                        <pubDate>Wed, 03 Sep 2025 09:58:25 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
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                                                            <title><![CDATA[ China-based firm delivers its first chipmaking tool that stamps nanoscale processor designs onto wafers — Prinano's nanoimprint lithography tool uses quartz molds engraved with circuits ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/china-based-firm-delivers-its-first-chipmaking-tool-that-stamps-nanoscale-chip-designs-onto-wafers-prinanos-nanoimprint-lithography-tool-uses-quartz-molds-engraved-with-circuits</link>
                                                                            <description>
                            <![CDATA[ China's Prinano Technology has shipped its first domestically developed semiconductor-grade step-and-repeat nanoimprint lithography system that offers sub-10 nm single-step patterning for applications like memory, photonics, and advanced packaging. ]]>
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                                                                        <pubDate>Fri, 15 Aug 2025 16:52:00 +0000</pubDate>                                                                                                                                <updated>Fri, 15 Aug 2025 16:59:42 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ApSKFpQCfh726LpLJTFnaK-1280-80.jpg">
                                                            <media:credit><![CDATA[Prinano]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Prinano]]></media:description>                                                            <media:text><![CDATA[Prinano]]></media:text>
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                                                            <title><![CDATA[ The U.S. and China are engaged in a race over chip development — both countries are racing to build infrastructure  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/the-u-s-and-china-are-engaged-in-a-race-over-chip-development-both-countries-are-racing-to-build-infrastructure</link>
                                                                            <description>
                            <![CDATA[ Both superpowers are building up chip development capabilities while trying to reduce dependencies upon one another. ]]>
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                                                                        <pubDate>Wed, 06 Aug 2025 12:50:00 +0000</pubDate>                                                                                                                                <updated>Thu, 07 Aug 2025 13:06:57 +0000</updated>
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                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Chris Stokel-Walker ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/EfES7N278kNgrfjcUvReaj-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[China and the US chess board]]></media:description>                                                            <media:text><![CDATA[China and the US chess board]]></media:text>
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                                                            <title><![CDATA[ EU fab tool makers get reprieve in EU-U.S. tariffs deal — ASML and others to be exempted from 15% duty ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/eu-fab-tool-makers-get-reprieve-in-eu-u-s-tariffs-deal-asml-and-others-to-be-exempted-from-15-percent-duty</link>
                                                                            <description>
                            <![CDATA[ A new U.S.–EU trade deal exempts semiconductor equipment from tariffs, avoiding steep cost hikes for American chipmakers and protecting the competitiveness of U.S. fabs. ]]>
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                                                                        <pubDate>Wed, 30 Jul 2025 10:32:17 +0000</pubDate>                                                                                                                                <updated>Wed, 30 Jul 2025 11:25:03 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pzamkiuguieyRnBYqYYHkW-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML]]></media:description>                                                            <media:text><![CDATA[ASML]]></media:text>
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                                                            <title><![CDATA[ Ex-ASML employee sentenced to three years' imprisonment for sharing company secrets with Russia ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/ex-asml-employee-sentenced-to-three-years-imprisonment-for-sharing-company-secrets-with-russia</link>
                                                                            <description>
                            <![CDATA[ An ex-ASML employee has been sentenced to three years imprisonment for sharing company secrets with a Russian contact. ]]>
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                                                                        <pubDate>Fri, 11 Jul 2025 12:30:32 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/8UBxmFkiTpTJkoES5eRCPi-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML]]></media:description>                                                            <media:text><![CDATA[ASML]]></media:text>
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                                                            <title><![CDATA[ China to pivot $50 billion chip fund to fighting U.S. squeeze as trade war escalates — country to back local companies and projects to overcome export controls ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/china-to-pivot-usd50-billion-chip-fund-to-fighting-u-s-squeeze-as-trade-war-escalates-country-to-back-local-companies-and-projects-to-overcome-export-controls</link>
                                                                            <description>
                            <![CDATA[ China's Big Fund III is refocusing on building local lithography equipment and chip design software after U.S. export bans blocked access to advanced tools, pushing managers to prioritize filling these critical gaps over supporting already strong areas. ]]>
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                                                                        <pubDate>Fri, 27 Jun 2025 14:33:29 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PoEW83on8deZDKn3RcA8we-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty /Yaorusheng]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[China chip graphic]]></media:description>                                                            <media:text><![CDATA[China chip graphic]]></media:text>
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                                                            <title><![CDATA[ Top semiconductor toolmaker launches talent competition in China — ASML is looking for 16 skilled lithography engineers ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/top-semiconductor-maker-launches-talent-competition-in-china-asml-is-looking-for-16-skilled-lithography-engineers</link>
                                                                            <description>
                            <![CDATA[ ASML launches an online competition in China to boost lithography awareness and recruit talented engineers for its operations in the country. ]]>
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                                                                        <pubDate>Fri, 27 Jun 2025 09:23:59 +0000</pubDate>                                                                                                                                <updated>Sat, 28 Jun 2025 13:34:26 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/sTYxT4FqfMMyrwcpqmHrQW-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML]]></media:description>                                                            <media:text><![CDATA[ASML]]></media:text>
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                                                            <title><![CDATA[ ASML's Impasto Project creates 3D digital twins of Vincent van Gogh's art with 100 gigabytes of data per scan — nanometer-capable chipmaking tech used to create ‘Google Maps for paintings’ ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/3d-printing/3d-scanning/asmls-impasto-project-creates-3d-digital-twins-of-vincent-van-goghs-art-with-100-gigabytes-of-data-per-scan-nanometer-capable-chipmaking-tech-used-to-create-google-maps-for-paintings</link>
                                                                            <description>
                            <![CDATA[ ASML and the Van Gogh museum have collaborated on the design of a 3D scanner to capture and create digital twins of the masterpieces of the Netherlands’ most famous artist. ]]>
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                                                                        <pubDate>Sat, 14 Jun 2025 14:19:59 +0000</pubDate>                                                                                                                                <updated>Fri, 08 Aug 2025 03:15:40 +0000</updated>
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                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/CggarnDPMZSZ8DdPbEqxAQ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML on X]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML gallery at the Van Gogh Museum]]></media:description>                                                            <media:text><![CDATA[ASML gallery at the Van Gogh Museum]]></media:text>
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                                                            <title><![CDATA[ Plans to shrink particle accelerators by 1,000x could speed chipmaking by 15X - Inversion Semiconductor proposes 'tabletop' particle accelerators with petawatt lasers ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/plans-to-shrink-particle-accelerators-by-1000x-could-speed-chipmaking-by-15x-inversion-semiconductor-proposes-tabletop-particle-accelerators-with-petawatt-lasers</link>
                                                                            <description>
                            <![CDATA[ Inversion Semiconductor, a 2024 startup backed by Y Combinator, aims to develop a compact, LWFA-based light source that 10 times more powerful than ASML's current EUV light sources while also targeting even shorter wavelengths. ]]>
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                                                                        <pubDate>Mon, 09 Jun 2025 17:09:56 +0000</pubDate>                                                                                                                                <updated>Tue, 09 Sep 2025 18:27:54 +0000</updated>
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                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/f5P7a7qwfopDaA4MsgPPoa-1280-80.jpg">
                                                            <media:credit><![CDATA[Inversion Lithography]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Inversion Lithography]]></media:description>                                                            <media:text><![CDATA[Inversion Lithography]]></media:text>
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                                                            <title><![CDATA[ ASML accelerates 50-football-fields-size mega expansion plans in the Netherlands ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-accelerates-50-football-fields-size-mega-expansion-plans-in-the-netherlands</link>
                                                                            <description>
                            <![CDATA[ ASML appears to have accelerated its ambitious expansion plans in the Netherlands. The site may be in action up to two years early. ]]>
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                                                                        <pubDate>Thu, 08 May 2025 10:48:16 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XtztRRqEqJoV6zqFSeJJ6Q-1280-80.jpg">
                                                            <media:credit><![CDATA[Stijn Steenbakkers]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML campus expansion plans]]></media:description>                                                            <media:text><![CDATA[ASML campus expansion plans]]></media:text>
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                                                            <title><![CDATA[ Intel has championed High-NA EUV chipmaking tools, but costs and other limitations could delay industry-wide adoption: Report ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/intel-has-championed-high-na-euv-chipmaking-tools-but-costs-and-other-limitations-could-delay-industry-wide-adoption-report</link>
                                                                            <description>
                            <![CDATA[ Intel has taken an early lead in High-NA EUV lithography, but widespread adoption remains constrained by high tool costs, limited exposure field size, and potential need for substantial ecosystem upgrades. ]]>
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                                                                        <pubDate>Wed, 16 Apr 2025 16:36:03 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:43:31 +0000</updated>
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                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML]]></media:description>                                                            <media:text><![CDATA[ASML]]></media:text>
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                                                            <title><![CDATA[ Atomic-scale chip alignment: Laser holograms could set new standard for 3D semiconductor overlay accuracy ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/atomic-scale-chip-alignment-laser-holograms-could-set-new-standard-for-3d-semiconductor-overlay-accuracy</link>
                                                                            <description>
                            <![CDATA[ UMass Amherst researchers have developed a laser-based holographic alignment method that could revolutionize overlay accuracy in semiconductor manufacturing, though its industrial adoption may hinge on integration with existing lithography systems. ]]>
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                                                                        <pubDate>Tue, 15 Apr 2025 11:20:00 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 10:07:46 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron]]></media:description>                                                            <media:text><![CDATA[Micron]]></media:text>
                                <media:title type="plain"><![CDATA[Micron]]></media:title>
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                                                            <title><![CDATA[ Trump administration exempts computer chips and copper from sweeping tariffs, but only for now — report says chip tariffs coming later ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/trump-administration-exempts-computer-chips-and-copper-from-sweeping-tariffs-but-only-for-now-report-says-chip-tariffs-coming-later</link>
                                                                            <description>
                            <![CDATA[ Donald Trump's new tariff plan imposes sweeping import taxes on nearly all U.S. trading partners starting in April, but key exclusions, especially for semiconductors, offer relief to American tech firms even as high-tech goods from Asia face steep price hikes. ]]>
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                                                                        <pubDate>Thu, 03 Apr 2025 13:43:14 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:40:09 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/kUacw6XQTQ3uMYvoWLHYLc-1280-80.jpg">
                                                            <media:credit><![CDATA[Arm]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Arm]]></media:description>                                                            <media:text><![CDATA[Arm]]></media:text>
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                                                            <title><![CDATA[ Russian spy infiltrates ASML and NXP to steal technical data necessary to build 28nm-capable fabs ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/russian-spy-infiltrates-asml-and-nxp-to-steal-technical-data-necessary-to-build-28nm-capable-fabs</link>
                                                                            <description>
                            <![CDATA[ A Russian engineer is accused of leaking confidential technical data from ASML, NXP, TSMC, and GlobalFoundries to Russia, allegedly to support construction of a 28nm-capable fab. ]]>
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                                                                        <pubDate>Wed, 02 Apr 2025 17:43:32 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:51:46 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/sTYxT4FqfMMyrwcpqmHrQW-1280-80.jpg">
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                                                            <title><![CDATA[ China's SiCarrier challenges U.S. and EU with full-spectrum of chipmaking equipment —  Huawei-linked firm makes an impressive debut ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/chinas-sicarrier-challenges-u-s-and-eu-with-full-spectrum-of-chipmaking-equipment-huawei-linked-firm-makes-an-impressive-debut</link>
                                                                            <description>
                            <![CDATA[ Huawei-linked Chinese startup has developed a nearly complete suite of semiconductor manufacturing tools to enable fully domestic chip production amid escalating export controls. ]]>
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                                                                        <pubDate>Thu, 27 Mar 2025 11:28:17 +0000</pubDate>                                                                                                                                <updated>Thu, 27 Mar 2025 11:28:40 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/RDRDxfSMpnNVf6QfdZd63b-1280-80.png">
                                                            <media:credit><![CDATA[GlobalFoundries]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[GlobalFoundries]]></media:description>                                                            <media:text><![CDATA[GlobalFoundries]]></media:text>
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                                                            <title><![CDATA[ EU preps Chips Act 2.0 to strengthen semiconductor industry after original program reportedly flopped ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/eu-preps-chips-act-2-0-to-stregthen-semiconductor-industry-after-original-program-reportedly-flopped</link>
                                                                            <description>
                            <![CDATA[ Chipmakers and producers of chipmaking tools call EU for the second round of European Chips Act funding. ]]>
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                                                                        <pubDate>Fri, 21 Mar 2025 18:16:05 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:41:50 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/i7yftgLyNyzawHNDnE42nd-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[TSMC]]></media:description>                                                            <media:text><![CDATA[TSMC]]></media:text>
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                                                            <title><![CDATA[ ASML recalls its humble origins in a ‘leaky shed’ in Eindhoven, circa 1984 — it now makes the most cutting-edge chipmaking tools on the planet ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/asml-recalls-its-humble-origins-in-a-leaky-shed-in-eindhoven-circa-1984-it-now-makes-the-most-cutting-edge-chipmaking-tools-on-the-planet</link>
                                                                            <description>
                            <![CDATA[ It now employs 44,000 people and raked in nearly $31B last year. ]]>
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                                                                        <pubDate>Thu, 20 Mar 2025 13:36:09 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/uyb2b8W7K6vrDvK34HGnkX-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML on LinkedIn]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML origins]]></media:description>                                                            <media:text><![CDATA[ASML origins]]></media:text>
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                                                            <title><![CDATA[ ASML teams up with Imec for sub-2nm process technologies with High-NA EUV chipmaking tools ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-teams-up-with-imec-for-sub-2nm-process-technologies-with-high-na-euv-chipmaking-tools</link>
                                                                            <description>
                            <![CDATA[ ASML to install its High-NA EUV lithography tools in Imec's pilot production line to give research and development personnel access to leading-edge equipment. ]]>
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                                                                        <pubDate>Wed, 12 Mar 2025 11:05:27 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:41:56 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/fdxw9P4zVFbAmcs3MtwjDE-1280-80.jpg">
                                                            <media:credit><![CDATA[Imec]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Imec]]></media:description>                                                            <media:text><![CDATA[Imec]]></media:text>
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                                                            <title><![CDATA[ Intel has processed 30,000 wafers with High-NA EUV chipmaking tool ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/intel-has-processed-30-000-wafers-with-high-na-euv-chipmaking-tool</link>
                                                                            <description>
                            <![CDATA[ Intel says ASML's High-NA EUV tools have produced 30,000 wafers in a single quarter. ]]>
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                                                                        <pubDate>Tue, 25 Feb 2025 17:21:36 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:53:44 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PQuTVKz3fP2hiK4DF7jvVJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML EUV machine]]></media:description>                                                            <media:text><![CDATA[ASML EUV machine]]></media:text>
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                                                            <title><![CDATA[ Trump wants tighter AI chip export restrictions but may face staffing shortage and other issues ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/trump-wants-tighter-ai-chip-export-restrictions-but-may-face-staffing-shortage-and-other-issues</link>
                                                                            <description>
                            <![CDATA[ Trump's administration believes restrictions on AI processors exports are not strict enough for close allies, also plans to persuade Japan and the Netherlands to curb services of ASML and TEL machines in China. ]]>
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                                                                        <pubDate>Tue, 25 Feb 2025 14:46:21 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 09:52:49 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XC7BztBiYaLzNEMYPXdhWc-1280-80.jpg">
                                                            <media:credit><![CDATA[Nvidia]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Nvidia Hopper HGX H200]]></media:description>                                                            <media:text><![CDATA[Nvidia Hopper HGX H200]]></media:text>
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                                                            <title><![CDATA[ Rapidus to reportedly install 10 EUV chipmaking tools at its fab in Japan ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/rapidus-to-reportedly-install-10-euv-litho-tools-into-its-fab-in-japan</link>
                                                                            <description>
                            <![CDATA[ Rapidus's IIM-1 and IIM-2 will feature 10 EUV lithography systems. ]]>
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                                                                        <pubDate>Thu, 30 Jan 2025 11:52:22 +0000</pubDate>                                                                                                                                <updated>Thu, 30 Jan 2025 11:52:55 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/VeUsd9vM4WBszDumWSs7gJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML EUV machine]]></media:description>                                                            <media:text><![CDATA[ASML EUV machine]]></media:text>
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                                                            <title><![CDATA[ Netherlands tightens export controls on sanctioned semiconductor equipment — move made in line with U.S. limitations, ASML will apply for licenses from the Dutch government ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/netherlands-tightens-export-controls-on-sanctioned-semiconductor-equipment-move-made-in-line-with-u-s-limitations-asml-will-apply-for-licenses-from-the-dutch-government</link>
                                                                            <description>
                            <![CDATA[ The Netherlands expands its export controls on measuring and inspection equipment to ensure that ASML applies for licenses locally, not in the U.S. ]]>
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                                                                        <pubDate>Wed, 15 Jan 2025 14:03:19 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PQuTVKz3fP2hiK4DF7jvVJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML EUV machine]]></media:description>                                                            <media:text><![CDATA[ASML EUV machine]]></media:text>
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                                                            <title><![CDATA[ ASML CEO says China is 10 to 15 years behind in chipmaking capabilities ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-ceo-says-china-is-10-to-15-years-behind-in-chipmaking-capabilities</link>
                                                                            <description>
                            <![CDATA[ Without EUV, Chinese semiconductor industry is over a decade behind Taiwan, U.S. ]]>
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                                                                        <pubDate>Wed, 25 Dec 2024 14:52:06 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:43:44 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pSy7xJedzqveFGvQJgoiTj-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML]]></media:description>                                                            <media:text><![CDATA[ASML]]></media:text>
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                                                            <title><![CDATA[ ASML reportedly cancels orders for the Lego EUV machine set — the kit is only available to ASML employees [Updated] ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-reportedly-cancels-orders-for-the-lego-euv-machine-set-from-non-asml-emails-the-kit-is-only-available-to-asml-employees</link>
                                                                            <description>
                            <![CDATA[ ASML offered Lego versions of its NA-EUV machines on the ASML store but has since limited it to orders from valid ASML email addresses only. ]]>
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                                                                        <pubDate>Sun, 22 Dec 2024 13:00:00 +0000</pubDate>                                                                                                                                <updated>Wed, 09 Apr 2025 13:01:44 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/odzELSwDLuXjWXMk9GNeeJ-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML Twinscan EXE:5000 Lego Set]]></media:description>                                                            <media:text><![CDATA[ASML Twinscan EXE:5000 Lego Set]]></media:text>
                                <media:title type="plain"><![CDATA[ASML Twinscan EXE:5000 Lego Set]]></media:title>
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                                                            <title><![CDATA[ Russia plans EUV chipmaking tools that it says will be cheaper and easier to build than ASML's — country outlines new roadmap to smaller chips ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/russia-plans-euv-chipmaking-tools-that-it-says-will-be-cheaper-and-easier-to-build-than-asmls-country-outlines-new-roadmap-to-smaller-chips</link>
                                                                            <description>
                            <![CDATA[ Russia to develop lithography systems that could compete against ASML's Twinscan NXE EUV systems. ]]>
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                                                                        <pubDate>Wed, 18 Dec 2024 12:34:46 +0000</pubDate>                                                                                                                                <updated>Wed, 18 Dec 2024 12:48:48 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/8a57BmBK6jv2XVhhgbFj3Y-1280-80.jpg">
                                                            <media:credit><![CDATA[Intel]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Intel]]></media:description>                                                            <media:text><![CDATA[Intel]]></media:text>
                                <media:title type="plain"><![CDATA[Intel]]></media:title>
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                                                            <title><![CDATA[ Russian Ex-ASML employee indicted for stealing critical trade secrets — currently in custody, faces 20-year Netherlands entry ban ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/russian-ex-asml-employee-indicted-for-stealing-critical-trade-secrets-currently-in-custody-faces-20-year-netherlands-entry-ban</link>
                                                                            <description>
                            <![CDATA[ A Russian engineer at ASML has been accused of stealing trade secrets at the company and now faces litigation and an entry-ban. ]]>
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                                                                        <pubDate>Sun, 08 Dec 2024 17:07:17 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 10:11:41 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Hassam Nasir) ]]></author>                    <dc:creator><![CDATA[ Hassam Nasir ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/sTYxT4FqfMMyrwcpqmHrQW-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML]]></media:description>                                                            <media:text><![CDATA[ASML]]></media:text>
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                                                            <title><![CDATA[ ASML made a $230 Lego kit version of its $380 million semiconductor tool — world's first High-NA EUV machine immortalized in small form for your mantle ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/asml-made-a-usd230-lego-kit-version-of-its-usd380-million-semiconductor-tool-worlds-first-high-na-euv-machine-immortalized-in-small-form-for-your-mantle</link>
                                                                            <description>
                            <![CDATA[ ASML has added the TWINSCAN EXE:5000 Lego set to its growing portfolio of gifts. ]]>
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                                                                        <pubDate>Sun, 01 Dec 2024 15:11:30 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 08:44:29 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Mark Tyson ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/ADb4ttFWLkqmvuGmWG5Ug7-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML lego gifts]]></media:description>                                                            <media:text><![CDATA[ASML lego gifts]]></media:text>
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                                                            <title><![CDATA[ Chinese companies poach staff from ASML and Zeiss with three times higher pay — employees needed to design and build chipmaking tools amid sanctions ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/chinese-companies-poach-staff-from-asml-and-zeiss-with-three-times-higher-pay-employees-needed-to-design-and-build-chipmaking-tools-amid-sanctions</link>
                                                                            <description>
                            <![CDATA[ Chinese companies aggressively recruiting personnel from ASML and Zeiss to build their own wafer fabbing equipment. ]]>
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                                                                        <pubDate>Thu, 28 Nov 2024 13:05:11 +0000</pubDate>                                                                                                                                <updated>Wed, 09 Apr 2025 12:57:48 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/sTYxT4FqfMMyrwcpqmHrQW-1280-80.jpg">
                                                            <media:credit><![CDATA[ASML]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[ASML]]></media:description>                                                            <media:text><![CDATA[ASML]]></media:text>
                                <media:title type="plain"><![CDATA[ASML]]></media:title>
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