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                    <title><![CDATA[ Latest from Tom's Hardware in Hbm ]]></title>
                <link>https://www.tomshardware.com/tag/hbm</link>
        <description><![CDATA[ All the latest hbm content from the Tom's Hardware team ]]></description>
                                    <lastBuildDate>Wed, 25 Mar 2026 16:39:57 +0000</lastBuildDate>
                            <language>en</language>
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                                                            <title><![CDATA[ Micron's $24 billion Singapore fab could need 500 transformers, more than double the output of any single manufacturer — heavy electrical infrastructure the latest AI buildout bottleneck ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/microns-24-billion-singapore-fab-could-need-500-transformers</link>
                                                                            <description>
                            <![CDATA[ Micron’s planned $24 billion NAND flash expansion in Singapore will require 400 to 500 power transformers, which is more than double the 100 to 150 units a standard wafer fab typically needs. ]]>
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                                                                        <pubDate>Wed, 25 Mar 2026 16:39:57 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron]]></media:description>                                                            <media:text><![CDATA[Micron]]></media:text>
                                <media:title type="plain"><![CDATA[Micron]]></media:title>
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                                                            <title><![CDATA[ SK Group chairman says memory chip shortage will last until 2030 — wafer supply trails demand by 20% ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/sk-group-chairman-says-memory-chip-shortage-will-last-until-2030</link>
                                                                            <description>
                            <![CDATA[ SK Group chairman Chey Tae-won told reporters at Nvidia's GTC conference in San Jose on Monday that the global memory chip shortage is likely to persist for another four to five years. ]]>
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                                                                        <pubDate>Wed, 18 Mar 2026 11:10:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/H2W39McUJD9PvHn7aRQM6d-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images / Jung Yeon-Je]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK Hynix logo ]]></media:description>                                                            <media:text><![CDATA[SK Hynix logo ]]></media:text>
                                <media:title type="plain"><![CDATA[SK Hynix logo ]]></media:title>
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                                                            <title><![CDATA[ Memory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers — forecasts suggest that 2026 revenue will skyrocket thanks to data center demand ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/memory-makers-are-set-to-earn-usd551-billion-from-the-ai-boom-twice-as-much-as-contract-chip-manufacturers-forecasts-suggest-that-2026-revenue-will-skyrocket-thanks-to-data-center-demand</link>
                                                                            <description>
                            <![CDATA[ While all makers of microelectronics are set to benefit from the AI supercycle, the memory industry is projected to generate more than twice the revenue of the foundry industry. ]]>
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                                                                        <pubDate>Tue, 10 Feb 2026 18:04:28 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pU95E8pwfvrx8dWfwg7X8M-1280-80.jpg">
                                                            <media:credit><![CDATA[Samsung]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Samsung]]></media:description>                                                            <media:text><![CDATA[Samsung]]></media:text>
                                <media:title type="plain"><![CDATA[Samsung]]></media:title>
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                                                            <title><![CDATA[ China’s CXMT and YMTC to increase memory output — two new fabs could close the gap with the ‘big three’ ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/chinas-cxmt-and-ymtc-to-expand-memory-output</link>
                                                                            <description>
                            <![CDATA[ China’s two largest memory manufacturers, CXMT and YMTC, are said to each be embarking on an unprecedented expansion spree as they see an opportunity to close the gap with the big-three incumbents. ]]>
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                                                                        <pubDate>Wed, 04 Feb 2026 12:18:07 +0000</pubDate>                                                                                                                                <updated>Wed, 04 Feb 2026 16:11:08 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/kn37VUizNE4pupG9VSSNR4-1280-80.jpg">
                                                            <media:credit><![CDATA[CXMT]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[CXMT DRAM]]></media:description>                                                            <media:text><![CDATA[CXMT DRAM]]></media:text>
                                <media:title type="plain"><![CDATA[CXMT DRAM]]></media:title>
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                                                            <title><![CDATA[ Chinese semiconductor industry gears up for domestic HBM3 production by the end of 2026 — CXMT to produce chips, while Naura, Maxwell, and U-Preseason design tools for assembly ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/chinese-semiconductor-industry-gears-up-for-domestic-hbm3-production-by-the-end-of-2026-cxmt-to-produce-chips-while-naura-maxwell-and-u-preseason-design-tools-for-assembly</link>
                                                                            <description>
                            <![CDATA[ The Chinese semiconductor industry is working to localize production of HBM3 memory, in addition to the tools required for HBM assembly. However, the exact progress of these projects is unknown. ]]>
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                                                                        <pubDate>Wed, 21 Jan 2026 16:30:49 +0000</pubDate>                                                                                                                                <updated>Wed, 21 Jan 2026 18:40:34 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/rKuXZChaKt4beGw9ao6w9-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images / Bloomberg]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[HBM 3 die]]></media:description>                                                            <media:text><![CDATA[HBM 3 die]]></media:text>
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                                                            <title><![CDATA[ SK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record — South Korea facility to handle packaging and testing for AI memory campus ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/sk-hynix-to-spend-usd13-billion-on-the-worlds-largest-hbm-memory-assembly-plant</link>
                                                                            <description>
                            <![CDATA[ SK hynix is investing $12.9 billion to build a campus-scale, HBM-only advanced packaging and test facility in Cheongju, South Korea, designed for the next generation of HBM memory and intended to ensure SK hynix's leadership in the booming market. ]]>
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                                                                        <pubDate>Wed, 14 Jan 2026 18:00:39 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/rXUooZyf8MGssFAtoZqAZY-1280-80.png">
                                                            <media:credit><![CDATA[SK Hynix]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK Hynix]]></media:description>                                                            <media:text><![CDATA[SK Hynix]]></media:text>
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                                                            <title><![CDATA[ Nvidia refutes reports of HBM4 mass production delay, production 'on track' for  the second half of 2025 — report suggested timeline shift to late Q126 due to revised spec ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/hbm4-mass-production-delayed-as-nvidia-pushes-memory-specs-higher</link>
                                                                            <description>
                            <![CDATA[ HBM4 memory is now expected to reach volume production no earlier than the end of Q1 2026 due to Nvidia's decision to revise its memory specs upward for its next-gen Rubin GPU platform. ]]>
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                                                                        <pubDate>Fri, 09 Jan 2026 10:32:04 +0000</pubDate>                                                                                                                                <updated>Tue, 13 Jan 2026 14:51:30 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/WPsDAmkaFLUsYpETvNW3n6-1280-80.jpg">
                                                            <media:credit><![CDATA[SK hynix]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK hynix HBM4 s&#039;mores]]></media:description>                                                            <media:text><![CDATA[SK hynix HBM4 s&#039;mores]]></media:text>
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                                                            <title><![CDATA[ Micron to begin work on $100 billion New York 'megafab' imminently — landmark site to produce 40% of company's overall DRAM output in the U.S. by the 2040s ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/micron-to-begin-work-on-usd100-billion-new-york-megafab-imminently-landmark-site-to-produce-40-percent-of-companys-overall-dram-output-in-the-u-s-by-the-2040s</link>
                                                                            <description>
                            <![CDATA[ After numerous delays, Micron is about to start building its $100 billion site in New York to produce 40% of its DRAM output in the U.S. in the 2040s. ]]>
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                                                                        <pubDate>Thu, 08 Jan 2026 17:02:31 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/MKPAJtT8MT8FuEjoJ2s7Ko-1280-80.jpg">
                                                            <media:credit><![CDATA[Credit: Micron Technology]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron&#039;s offices in Allen, Texas]]></media:description>                                                            <media:text><![CDATA[Micron&#039;s offices in Allen, Texas]]></media:text>
                                <media:title type="plain"><![CDATA[Micron&#039;s offices in Allen, Texas]]></media:title>
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                                                            <title><![CDATA[ Nvidia CEO Jensen Huang explains why SRAM isn't here to eat HBM's lunch — high bandwidth memory offers more flexibility in AI deployments across a range of workloads ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/nvidia-ceo-jensen-huang-makes-the-case-against-optimizing-ai-hardware-too-narrowly-at-ces</link>
                                                                            <description>
                            <![CDATA[ At CES, Jensen Huang was pressed on margins, memory costs, and whether Nvidia’s growing use of SRAM and open AI models might finally loosen the company’s grip on expensive HBM. ]]>
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                                                                        <pubDate>Wed, 07 Jan 2026 18:08:53 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/PMvbn6SffjSehAWnPwtzkB-1280-80.jpg">
                                                            <media:credit><![CDATA[Tom&#039;s Hardware]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Jensen Huang]]></media:description>                                                            <media:text><![CDATA[Jensen Huang]]></media:text>
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                                                            <title><![CDATA[ Micron secures $318 million Taiwanese subsidy for HBM R&D as AI memory arms race intensifies — three-year project aims to develop leading-edge, high-performance memory ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/micron-secures-318-million-taiwanese-subsidy-for-hbm-rd-as-ai-memory-arms-race-intensifies</link>
                                                                            <description>
                            <![CDATA[ Micron has secured another major vote of confidence from the Taiwanese government, winning approval for an additional NT$4.7 billion (approximately $149 million) in subsidies to expand HBM research and development in Taiwan. ]]>
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                                                                        <pubDate>Fri, 02 Jan 2026 17:06:50 +0000</pubDate>                                                                                                                                <updated>Fri, 02 Jan 2026 17:07:06 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vD8rzmDbiAqw5idpPhDpZ5-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron&#039;s HBM4]]></media:description>                                                            <media:text><![CDATA[Micron&#039;s HBM4]]></media:text>
                                <media:title type="plain"><![CDATA[Micron&#039;s HBM4]]></media:title>
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                                                            <title><![CDATA[ A deeper look at the tightened chipmaking supply chain, and where it may be headed in 2026 — "nobody's scaling up,” says analyst as industry remains conservative on capacity ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/a-deeper-look-at-the-tightened-chipmaking-supply-chain-and-where-it-may-be-headed-in-2026-nobodys-scaling-up-says-analyst-as-industry-remains-conservative-on-capacity</link>
                                                                            <description>
                            <![CDATA[ We interview two industry analysts to gauge the current state of the chipmaking ecosystem, including constraints across the entire supply chain, and where it might be headed next. ]]>
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                                                                        <pubDate>Fri, 02 Jan 2026 14:24:37 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Chris Stokel-Walker ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/YAQU3zRSbuCHbUYm5L4oD4-1280-80.jpg">
                                                            <media:credit><![CDATA[TSMC]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[TSMC]]></media:description>                                                            <media:text><![CDATA[TSMC]]></media:text>
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                                                            <title><![CDATA[ SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/sk-hynix-to-build-first-us-2-5d-packaging-plant-for-hbm</link>
                                                                            <description>
                            <![CDATA[ SK hynix is bringing its HBM ambitions to U.S. soil with a $3.9 billion plan to build its first domestic manufacturing facility — a 2.5D advanced packaging plant in West Lafayette, Indiana. ]]>
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                                                                        <pubDate>Tue, 30 Dec 2025 21:01:50 +0000</pubDate>                                                                                                                                <updated>Tue, 30 Dec 2025 21:06:00 +0000</updated>
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                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/Er72Z5ypamnsAPsGrhUnfd-1280-80.jpg">
                                                            <media:credit><![CDATA[SK hynix]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK hynix chips]]></media:description>                                                            <media:text><![CDATA[SK hynix chips]]></media:text>
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                                                            <title><![CDATA[ SK hynix expands U.S. presence with new Bellevue, Seattle office in efforts to get closer to its largest customers — offices near Nvidia, Amazon, and Microsoft highlight co-designed HBM efforts ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/sk-hynix-expands-us-footprint-with-seattle-area-office-near-nvidia-and-amazon</link>
                                                                            <description>
                            <![CDATA[ SK hynix is expanding its U.S. presence with a new office in the Seattle metropolitan area, placing the world’s leading HBM supplier within minutes of Nvidia, Amazon, and Microsoft. ]]>
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                                                                        <pubDate>Wed, 24 Dec 2025 17:56:35 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/w8pDnVdADakuWR4qK6Lksc-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty Images / Jung Yeon-Je]]></media:credit>
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                                                            <title><![CDATA[ Here's why HBM is coming for your PC's RAM —  HBM consumes around three times the wafer capacity of DDR5 per gigabyte, as AI supercharges demand for chips and advanced packaging ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/ram/hbm-is-eating-your-ram</link>
                                                                            <description>
                            <![CDATA[ AI’s appetite for high-bandwidth memory is reshaping the global DRAM and NAND market, diverting wafer capacity and advanced packaging away from consumer products and driving sharp price increases across markets. ]]>
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                                                                        <pubDate>Fri, 19 Dec 2025 16:36:13 +0000</pubDate>                                                                                                                                <updated>Sat, 20 Dec 2025 10:30:45 +0000</updated>
                                                                                                                                            <category><![CDATA[RAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/B5eSTUQDi88b2yTqQZJUcX-1280-80.jpg">
                                                            <media:credit><![CDATA[Future]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Best RAM deals]]></media:description>                                                            <media:text><![CDATA[Best RAM deals]]></media:text>
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                                                            <title><![CDATA[ Cambricon targets 500,000 AI chips in 2026 as China accelerates domestic hardware push — low yields and limited HBM supply could threaten chip ambitions  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/cambricon-targets-500000-ai-chips-in-2026-as-china-accelerates-domestic-hardware-push</link>
                                                                            <description>
                            <![CDATA[ Cambricon Technologies is preparing one of the most aggressive production ramp-ups attempted by a Chinese AI chipmaker. ]]>
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                                                                        <pubDate>Fri, 12 Dec 2025 11:00:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
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                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vC6FAbqKEZ238s2NtuKEF4-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Cambricon chip.]]></media:description>                                                            <media:text><![CDATA[Cambricon chip.]]></media:text>
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                                                            <title><![CDATA[ HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/hbm-undergoes-major-architectural-shakeup-as-tsmc-and-guc-detail-hbm4-hbm4e-and-c-hbm4e-3nm-base-dies-to-enable-2-5x-performance-boost-with-speeds-of-up-to-12-8gt-s-by-2027</link>
                                                                            <description>
                            <![CDATA[ HBM is undergoing its first major architectural overhaul in a decade, as HBM4, HBM4E, and C-HBM4E will introduce a 2048-bit interface, logic-node base dies, and optional custom memory logic inside base dies, enabling up to a 2.5X performance leap between 2025 and 2027. ]]>
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                                                                        <pubDate>Tue, 02 Dec 2025 18:30:06 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/SGkyZ5MswpGGR4PqwZ98FG-1280-80.jpg">
                                                            <media:credit><![CDATA[SK Hynix]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK Hynix&#039;s HBM4]]></media:description>                                                            <media:text><![CDATA[SK Hynix&#039;s HBM4]]></media:text>
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                                                            <title><![CDATA[ Micron plans $9.6 billion HBM fab in Japan as AI memory race accelerates ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/micron-plans-hbm-fab-in-japan-as-ai-memory-race-accelerates</link>
                                                                            <description>
                            <![CDATA[ Micron is preparing a major expansion of its Hiroshima operations to build a dedicated high-bandwidth memory facility, according to a report by Nikkei Asia. ]]>
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                                                                        <pubDate>Sun, 30 Nov 2025 12:55:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Luke James ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/wp4T44r9dNXJUiU6tSQrVS-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron Electronics]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron&#039;s existing factory in Hiroshima, Japan]]></media:description>                                                            <media:text><![CDATA[Micron&#039;s existing factory in Hiroshima, Japan]]></media:text>
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                                                            <title><![CDATA[ Chinese memory maker reportedly preparing for $42 billion IPO — CXMT plans to go public in early 2026 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/chinese-memory-maker-reportedly-preparing-for-usd42-billion-ipo-cxmt-plans-to-go-public-in-early-2026</link>
                                                                            <description>
                            <![CDATA[ CXMT is reportedly planning to go public, hoping to raise $2.5 to $6 billion in fresh funds. ]]>
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                                                                        <pubDate>Tue, 21 Oct 2025 12:18:44 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/qWVur4sDMJow8rQDDH6JJi-1280-80.jpg">
                                                            <media:credit><![CDATA[CXMT]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[CXMT DRAM facility render image]]></media:description>                                                            <media:text><![CDATA[CXMT DRAM facility render image]]></media:text>
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                                                            <title><![CDATA[ Phison CEO claims NAND shortage could last a staggering 10 years — says memory 'supercycle' imminent and 'severe' 2026 shortages are at hand ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/ssds/phison-ceo-claims-nand-shortage-could-last-a-staggering-10-years-says-memory-supercycle-imminent-and-severe-2026-shortages-are-at-hand</link>
                                                                            <description>
                            <![CDATA[ Phison CEO Pua Khein-Seng has claimed in an interview this week that the upcoming forecasted NAND flash shortage will last "for the next ten years", rather than the more optimistic 1 year claimed by other industry insiders. The negative implications of the AI boom continue to grow by the day. ]]>
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                                                                        <pubDate>Thu, 02 Oct 2025 16:44:07 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[SSDs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[Storage]]></category>
                                                                                                                    <dc:creator><![CDATA[ Sunny Grimm ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/iHNpsAJJPxBe5b4iXgMfUG-1280-80.jpg">
                                                            <media:credit><![CDATA[Getty / Bloomberg]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Phison CEO]]></media:description>                                                            <media:text><![CDATA[Phison CEO]]></media:text>
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                                                            <title><![CDATA[ New 3D-stacked memory tech seeks to dethrone HBM for AI inference — d-Matrix claims 3DIMC will be 10x faster and 10x more efficient ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/ram/new-3d-stacked-memory-tech-seeks-to-dethrone-hbm-in-ai-inference-d-matrix-claims-3dimc-will-be-10x-faster-and-10x-more-efficient</link>
                                                                            <description>
                            <![CDATA[ Santa Clara-based startup d-Matrix looks to replace HBM in AI inference with 3DIMC, or 3D digital in-memory-compute. The company's goals for the tech are to create a memory chip that is 10x more efficient and 10x faster than HBM in AI inference tasks. ]]>
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                                                                        <pubDate>Thu, 04 Sep 2025 10:00:00 +0000</pubDate>                                                                                                                                <updated>Thu, 04 Sep 2025 12:23:09 +0000</updated>
                                                                                                                                            <category><![CDATA[RAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                                    <dc:creator><![CDATA[ Sunny Grimm ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/qwTGkJNzwkiGggMEVtPXvd-1280-80.jpg">
                                                            <media:credit><![CDATA[d-Matrix, Inc.]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[An explainer image of d-Matrix Pavehawk, a 3D stacked memory solution.]]></media:description>                                                            <media:text><![CDATA[An explainer image of d-Matrix Pavehawk, a 3D stacked memory solution.]]></media:text>
                                <media:title type="plain"><![CDATA[An explainer image of d-Matrix Pavehawk, a 3D stacked memory solution.]]></media:title>
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                                                            <title><![CDATA[ Kioxia’s new 5TB, 64 GB/s flash module puts NAND toward the memory bus for AI GPUs — HBF prototype adopts familiar SSD form factor ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/gpus/kioxias-new-5tb-64-gb-s-flash-module-puts-nand-toward-the-memory-bus-for-ai-gpus-hbf-prototype-adopts-familiar-ssd-form-factor</link>
                                                                            <description>
                            <![CDATA[ Kioxia has prototyped a 5 TB flash module that delivers 64 GB/s over PCIe 6.0, utilizing a daisy-chain controller design and PAM4 signaling to scale bandwidth efficiently. While latency still lags behind DRAM, the breakthrough positions NAND as near-memory storage for AI and data-intensive workloads. ]]>
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                                                                        <pubDate>Sat, 23 Aug 2025 17:00:20 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[GPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Hassam Nasir) ]]></author>                    <dc:creator><![CDATA[ Hassam Nasir ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XHTefDnBAzfSqWBTT8KvTW-1280-80.jpg">
                                                            <media:credit><![CDATA[Kioxia]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Kioxia]]></media:description>                                                            <media:text><![CDATA[Kioxia]]></media:text>
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                                                            <title><![CDATA[ How the AI revolution is triggering a hardware arms race and pushing up prices ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/how-the-ai-revolution-is-triggering-a-hardware-arms-race-and-pushing-up-prices</link>
                                                                            <description>
                            <![CDATA[ Tech giants and hyperscalers are paying billions to build out large data centers for AI, creating supply chain bottlenecks and intense competition for technological dominance. ]]>
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                                                                        <pubDate>Fri, 22 Aug 2025 17:56:57 +0000</pubDate>                                                                                                                                <updated>Fri, 22 Aug 2025 17:57:02 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                                    <dc:creator><![CDATA[ Chris Stokel-Walker ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/Jsd54JzWbwq3Hnf2bEvucA-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[A dark render of a data center]]></media:description>                                                            <media:text><![CDATA[A dark render of a data center]]></media:text>
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                                                            <title><![CDATA[ Huawei releases new tool to get Chinese firms around crushing HBM export blacklist — new UCM software claims up to 22x throughput gain and 90% latency reduction for traditional cache hierarchies in AI workloads ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/artificial-intelligence/huawei-releases-new-tool-to-get-chinese-firms-around-crushing-hbm-export-blacklist-new-ucm-software-claims-up-to-22x-throughput-gain-and-90-percent-latency-reduction-for-traditional-cache-hierarchies-in-ai-workloads</link>
                                                                            <description>
                            <![CDATA[ Huawei's newest software tool, called the Unified Cache Manager, seeks to optimize utilization across the traditional cache hierarchy for AI inference, allowing China's AI firms to be more competitive without the need for exotic HBM memory that is near-impossible to obtain in the country. ]]>
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                                                                        <pubDate>Wed, 13 Aug 2025 09:50:00 +0000</pubDate>                                                                                                                                <updated>Wed, 13 Aug 2025 17:38:36 +0000</updated>
                                                                                                                                            <category><![CDATA[Artificial Intelligence]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                                                                                    <dc:creator><![CDATA[ Sunny Grimm ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/k9JYN2JU7nUu4Rr65x9G9a-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[Huawei]]></media:description>                                                            <media:text><![CDATA[Huawei]]></media:text>
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                                                            <title><![CDATA[ SK hynix projects HBM market to be worth tens of billions of dollars by 2030 — says AI memory industry will expand 30% annually over five years ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/sk-hynix-projects-hbm-market-to-be-worth-tens-of-billions-of-dollars-by-2030-says-ai-memory-industry-will-expand-30-percent-annually-over-five-years</link>
                                                                            <description>
                            <![CDATA[ SK Hynix sees the AI-focused High Bandwidth Memory market growing about 30% each year to 2030, approaching $98B. Holding 70% share, it’s banking on custom designs, HBM4, and U.S. expansion to keep its edge—despite looming oversupply, rising competition, and the uncertainty of trade politics. ]]>
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                                                                        <pubDate>Mon, 11 Aug 2025 15:39:04 +0000</pubDate>                                                                                                                                <updated>Mon, 11 Aug 2025 21:22:27 +0000</updated>
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                                                                                                <author><![CDATA[ editors@tomshardware.com (Hassam Nasir) ]]></author>                    <dc:creator><![CDATA[ Hassam Nasir ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/u7fGSauEfGSYzzZLv7ZSwm-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[SK hynix sign outside its South Korea headquarters]]></media:description>                                                            <media:text><![CDATA[SK hynix sign outside its South Korea headquarters]]></media:text>
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                                                            <title><![CDATA[ Sandisk and SK hynix join forces to standardize High Bandwidth Flash memory, a NAND-based alternative to HBM for AI GPUs — Move could enable 8-16x higher capacity compared to DRAM ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/sandisk-and-sk-hynix-join-forces-to-standardize-high-bandwidth-flash-memory-a-nand-based-alternative-to-hbm-for-ai-gpus-move-could-enable-8-16x-higher-capacity-compared-to-dram</link>
                                                                            <description>
                            <![CDATA[ Sandisk and SK hynix have announced they're collaborating on High Bandwidth Flash (HBF)—a potential alternative to traditional, DRAM-based HBM for AI GPUs. Instead of only relying on DRAM, HBF adds NAND to the memory stack, allowing for non-volatility that can cut energy (and thermal) costs, along with upping the storage capacity. ]]>
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                                                                        <pubDate>Thu, 07 Aug 2025 12:42:45 +0000</pubDate>                                                                                                                                <updated>Thu, 07 Aug 2025 15:16:07 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Hassam Nasir) ]]></author>                    <dc:creator><![CDATA[ Hassam Nasir ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/VNoTXazt4WuxtkoAy3VWmg-1280-80.jpg">
                                                            <media:credit><![CDATA[SanDisk]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SanDisk&#039;s HBF memory concept]]></media:description>                                                            <media:text><![CDATA[SanDisk&#039;s HBF memory concept]]></media:text>
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                                                            <title><![CDATA[ HBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/semiconductors/hbm-roadmaps-for-micron-samsung-and-sk-hynix-to-hbm4-and-beyond</link>
                                                                            <description>
                            <![CDATA[ We've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E. ]]>
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                                                                        <pubDate>Wed, 06 Aug 2025 12:50:00 +0000</pubDate>                                                                                                                                <updated>Fri, 15 Aug 2025 15:54:47 +0000</updated>
                                                                                                                                            <category><![CDATA[Semiconductors]]></category>
                                                    <category><![CDATA[Tech Industry]]></category>
                                                    <category><![CDATA[Manufacturing]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/GJFEiCgnw2XZPCD76to9yT-1280-80.png">
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                                                            <title><![CDATA[ DRAM prices are about to skyrocket — DDR4 and GDDR6 among formats that could increase in price by up to 45% ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/dram-prices-are-about-to-skyrocket-ddr4-and-gddr6-among-formats-that-could-increase-in-price-by-up-to-45-percent</link>
                                                                            <description>
                            <![CDATA[ DRAM prices are set to rise sharply in Q3 2025, with legacy memory types like DDR4, LPDDR4X, and GDDR6 seeing the steepest increases of up to 45% due to supply cuts and phase-outs. The effect of U.S. tariffs on memory imports from Japan and South Korea is still to be determined, but it will likely be drastic. ]]>
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                                                                        <pubDate>Tue, 08 Jul 2025 15:10:02 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/3Mzq2qSfDomH6XiaY2FYah-1280-80.jpg">
                                                            <media:credit><![CDATA[SK Hynix]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK Hynix]]></media:description>                                                            <media:text><![CDATA[SK Hynix]]></media:text>
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                                                            <title><![CDATA[ Micron details new U.S. fab projects: HBM assembly comes to the U.S., Idaho Fab comes online in 2027, New York fabs later  ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/micron-details-new-u-s-fab-projects-idaho-fab-1-comes-online-in-2h-2027-new-york-fabs-come-later-hbm-assembly-in-the-u-s</link>
                                                                            <description>
                            <![CDATA[ Micron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years. ]]>
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                                                                        <pubDate>Tue, 01 Jul 2025 10:00:01 +0000</pubDate>                                                                                                                                <updated>Tue, 09 Sep 2025 18:27:55 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/MKPAJtT8MT8FuEjoJ2s7Ko-1280-80.jpg">
                                                            <media:credit><![CDATA[Credit: Micron Technology]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron&#039;s offices in Allen, Texas]]></media:description>                                                            <media:text><![CDATA[Micron&#039;s offices in Allen, Texas]]></media:text>
                                <media:title type="plain"><![CDATA[Micron&#039;s offices in Allen, Texas]]></media:title>
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                                                            <title><![CDATA[ HBM development roadmap revealed: HBM8 with a 16,384-bit interface and embedded NAND in 2038 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/hbm-development-roadmap-revealed-hbm8-with-a-16-384-bit-interface-and-embedded-nand-in-2038</link>
                                                                            <description>
                            <![CDATA[ KAIST has a roadmap projecting the evolution of high-bandwidth memory from HBM4 to HBM8 through 2038, detailing major gains in bandwidth, capacity, I/O width, power, and even system architecture. ]]>
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                                                                        <pubDate>Mon, 16 Jun 2025 11:02:14 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/GJFEiCgnw2XZPCD76to9yT-1280-80.png">
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                                                            <title><![CDATA[ Micron starts to ship samples of HBM4 memory to clients — 36 GB capacity and bandwidth of 2 TB/s ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/micron-starts-to-ship-samples-of-hbm4-memory-to-clients-36-gb-capacity-and-bandwidth-of-2-tb-s</link>
                                                                            <description>
                            <![CDATA[ Micron has become the first DRAM vendor to begin sampling 36GB HBM4 memory with a 2048-bit interface and 2TB/s bandwidth. ]]>
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                                                                        <pubDate>Thu, 12 Jun 2025 14:59:35 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vD8rzmDbiAqw5idpPhDpZ5-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron&#039;s HBM4]]></media:description>                                                            <media:text><![CDATA[Micron&#039;s HBM4]]></media:text>
                                <media:title type="plain"><![CDATA[Micron&#039;s HBM4]]></media:title>
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                                                            <title><![CDATA[ Intel and SoftBank collaborate on power-efficient HBM substitute for AI data centers, says report ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/intel-and-softbank-collaborate-on-power-efficient-hbm-substitute-for-ai-data-centers-says-report</link>
                                                                            <description>
                            <![CDATA[ SoftBank wants to corner the AI chip memory market with a more efficient substitute to HBM. ]]>
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                                                                        <pubDate>Sun, 01 Jun 2025 12:08:20 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Jowi Morales) ]]></author>                    <dc:creator><![CDATA[ Jowi Morales ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/imxMRybSPedrefPS8M78am-1280-80.jpg">
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                                                                                                                                                                        <media:description><![CDATA[RAM]]></media:description>                                                            <media:text><![CDATA[RAM]]></media:text>
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                                                            <title><![CDATA[ Nvidia's H20 follow-up in China won't be based on Hopper, says Jensen — Reportedly switching from HBM to GDDR7 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/gpus/nvidias-h20-follow-up-in-china-wont-be-based-on-hopper-says-jensen-reportedly-switching-from-hbm-to-gddr7</link>
                                                                            <description>
                            <![CDATA[ Future AI accelerators for China will not use the Hopper architecture, as Jensen Huang hints at a potential switch to Blackwell. ]]>
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                                                                        <pubDate>Sun, 18 May 2025 14:47:26 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:51:53 +0000</updated>
                                                                                                                                            <category><![CDATA[GPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Hassam Nasir) ]]></author>                    <dc:creator><![CDATA[ Hassam Nasir ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/XC7BztBiYaLzNEMYPXdhWc-1280-80.jpg">
                                                            <media:credit><![CDATA[Nvidia]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Nvidia Hopper HGX H200]]></media:description>                                                            <media:text><![CDATA[Nvidia Hopper HGX H200]]></media:text>
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                                                            <title><![CDATA[ Samsung to adopt hybrid bonding for HBM4 memory ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/samsung-to-adopt-hybrid-bonding-for-hbm4-memory</link>
                                                                            <description>
                            <![CDATA[ Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns. ]]>
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                                                                        <pubDate>Tue, 13 May 2025 18:58:33 +0000</pubDate>                                                                                                                                <updated>Tue, 09 Sep 2025 18:27:54 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/GJFEiCgnw2XZPCD76to9yT-1280-80.png">
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                                                            <title><![CDATA[ Micron confirms memory price hikes as AI and data center demand surges ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/micron-confirms-memory-price-hikes-as-ai-and-data-center-demand-surges</link>
                                                                            <description>
                            <![CDATA[ With demand surging across multiple sectors, the U.S. memory giant is adjusting prices to match the tightening supply. ]]>
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                                                                        <pubDate>Mon, 31 Mar 2025 17:43:12 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:42:27 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Kunal Khullar) ]]></author>                    <dc:creator><![CDATA[ Kunal Khullar ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/9o8QuQPFBFKJfLnpN89LcH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron]]></media:description>                                                            <media:text><![CDATA[Micron]]></media:text>
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                                                            <title><![CDATA[ Micron unveils DDR5-9200 memory: 1γ process technology with EUV ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/micron-unveils-ddr5-9200-memory-1g-process-technology-with-euv</link>
                                                                            <description>
                            <![CDATA[ Micron's 1γ fabrication technology with EUV, new HKMG, and BEOL promises to increase performance while cutting power consumption for DRAM. ]]>
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                                                                        <pubDate>Tue, 25 Feb 2025 18:57:21 +0000</pubDate>                                                                                                                                <updated>Fri, 14 Mar 2025 14:14:56 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/vnqdtRupVqWHAik43ZWctH-1280-80.jpg">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron]]></media:description>                                                            <media:text><![CDATA[Micron]]></media:text>
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                                                            <title><![CDATA[ SanDisk's new High Bandwidth Flash memory enables 4TB of VRAM on GPUs, matches HBM bandwidth at higher capacity ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/sandisks-new-hbf-memory-enables-up-to-4tb-of-vram-on-gpus-matches-hbm-bandwidth-at-higher-capacity</link>
                                                                            <description>
                            <![CDATA[ SanDisk talks high bandwidth flash memory that promises to wed HBM bandwidth with 3D NAND capacity. ]]>
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                                                                        <pubDate>Thu, 13 Feb 2025 12:16:56 +0000</pubDate>                                                                                                                                <updated>Wed, 09 Apr 2025 13:01:54 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/32ax3i7i4sgLXwvXnC8uNg-1280-80.jpg">
                                                            <media:credit><![CDATA[SanDisk]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SanDisk&#039;s HBF memory concept]]></media:description>                                                            <media:text><![CDATA[SanDisk&#039;s HBF memory concept]]></media:text>
                                <media:title type="plain"><![CDATA[SanDisk&#039;s HBF memory concept]]></media:title>
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                                                            <title><![CDATA[ Third Chinese company begins HBM memory production for AI processors: Report ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/third-chinese-company-begins-hbm-memory-production-for-ai-processors-report</link>
                                                                            <description>
                            <![CDATA[ Tongfu Microelectronics joins CXMT and Wuhan Xinxin in HBM production for Chinese developers of AI processors. ]]>
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                                                                        <pubDate>Fri, 24 Jan 2025 20:55:34 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:45:05 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/GJFEiCgnw2XZPCD76to9yT-1280-80.png">
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                                                            <title><![CDATA[ SK hynix posts record revenues and profits as AI industry drives surge in HBM3 and HBM3E demand ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/sk-hynix-posts-record-revenues-and-profits-as-ai-industry-drives-surge-in-hbm3-and-hbm3e-demand</link>
                                                                            <description>
                            <![CDATA[ Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels. ]]>
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                                                                        <pubDate>Thu, 23 Jan 2025 13:45:00 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/35oc94EpnniQ3v4gXpJVUm-1280-80.png">
                                                            <media:credit><![CDATA[SK Hynix]]></media:credit>
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                                                            <title><![CDATA[ SK hynix to showcase 16-layer HBM3E, 122TB enterprise SSD, LPCAMM2, and more at CES ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/sk-hynix-to-showcase-16-layer-hbm3e-122tb-enterprise-ssd-lpcamm23-and-more-at-ces</link>
                                                                            <description>
                            <![CDATA[ The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new solutions to improve AI performance ]]>
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                                                                        <pubDate>Thu, 09 Jan 2025 15:12:43 +0000</pubDate>                                                                                                                                <updated>Thu, 09 Jan 2025 22:40:49 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Kunal Khullar) ]]></author>                    <dc:creator><![CDATA[ Kunal Khullar ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/DjNrGQvi4oajkrfhpdzunB-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[SK Hynix CEO at the HBM3E 16-Hi Stack memory announcement]]></media:description>                                                            <media:text><![CDATA[SK Hynix CEO at the HBM3E 16-Hi Stack memory announcement]]></media:text>
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                                                            <title><![CDATA[ Micron invests $7 billion in HBM assembly facility amid AI boom ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/micron-invests-usd7-billion-in-hbm-assembly-facility-amid-ai-boom</link>
                                                                            <description>
                            <![CDATA[ Micron to expand HBM3E and HBM4 output when its HBM assembly facility in Singapore start operations in 2026. ]]>
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                                                                        <pubDate>Wed, 08 Jan 2025 17:38:14 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/GJFEiCgnw2XZPCD76to9yT-1280-80.png">
                                                            <media:credit><![CDATA[Micron]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron&#039;s HBM3E memory stack]]></media:description>                                                            <media:text><![CDATA[Micron&#039;s HBM3E memory stack]]></media:text>
                                <media:title type="plain"><![CDATA[Micron&#039;s HBM3E memory stack]]></media:title>
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                                                            <title><![CDATA[ US to reportedly sanction 200 more Chinese chip firms — high bandwidth memory might also see export bans ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/us-to-reportedly-sanction-200-more-chinese-chip-firms-high-bandwidth-memory-might-also-see-export-bans</link>
                                                                            <description>
                            <![CDATA[ The latest round of US sanctions imposes tighter control over the export of US technology to 200 more chip makers in China. ]]>
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                                                                        <pubDate>Mon, 25 Nov 2024 19:26:45 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:43:02 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ editors@tomshardware.com (Hassam Nasir) ]]></author>                    <dc:creator><![CDATA[ Hassam Nasir ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/wtn2YAGLUS3Wu5q8RXbaFj-1280-80.jpg">
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                                                                                                                                                                                                                                    <media:description><![CDATA[China USA]]></media:description>                                                            <media:text><![CDATA[China USA]]></media:text>
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                                                            <title><![CDATA[ Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/gpus/nvidia-asked-sk-hynix-to-accelerate-hbm4-chip-delivery-by-six-months-says-report</link>
                                                                            <description>
                            <![CDATA[ SK hynix to deliver HBM4 memory to Nvidia about half of a year ahead of planned schedule. ]]>
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                                                                        <pubDate>Tue, 05 Nov 2024 12:00:00 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 10:06:51 +0000</updated>
                                                                                                                                            <category><![CDATA[GPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/GJFEiCgnw2XZPCD76to9yT-1280-80.png">
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                                                            <title><![CDATA[ SK hynix preps for Nvidia Blackwell Ultra and AMD Instinct MI325X with 12-Hi HBM3E ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/gpus/sk-hynix-preps-for-nvidia-blackwell-ultra-and-amd-instinct-mi325x-with-12-hi-hbm3e</link>
                                                                            <description>
                            <![CDATA[ SK hynix kicks off mass production of 12-Hi HBM3E for AMD's MI 325X, Nvidia's Blackwell Ultra, other high-performance processors. ]]>
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                                                                        <pubDate>Thu, 26 Sep 2024 13:08:09 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 09:48:08 +0000</updated>
                                                                                                                                            <category><![CDATA[GPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/pVW4FzjzUfufSZhLYV7ar3-1280-80.jpg">
                                                            <media:credit><![CDATA[SK Hynix]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK Hynix&#039;s 12-Hi HBM3E]]></media:description>                                                            <media:text><![CDATA[SK Hynix&#039;s 12-Hi HBM3E]]></media:text>
                                <media:title type="plain"><![CDATA[SK Hynix&#039;s 12-Hi HBM3E]]></media:title>
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                                                            <title><![CDATA[ Rambus announces HBM4 memory controller for AI GPUs — controller enables up to of 2.56 TB/s per HBM4 memory stack across a 2048-bit memory bus ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/rambus-announces-hbm4-memory-controller-for-ai-gpus-controller-enables-up-to-of-256-tbs-per-hbm4-memory-stack-across-a-2048-bit-memory-bus</link>
                                                                            <description>
                            <![CDATA[ Rambus's HBM4 controller has a lot of performance headroom, but will it ever be used? ]]>
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                                                                        <pubDate>Tue, 10 Sep 2024 15:18:27 +0000</pubDate>                                                                                                                                <updated>Wed, 09 Apr 2025 13:02:05 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-1280-80.png">
                                                            <media:credit><![CDATA[AMD]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[AMD]]></media:description>                                                            <media:text><![CDATA[AMD]]></media:text>
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                                                            <title><![CDATA[ Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/samsung-to-tape-out-first-hbm4-devices-later-this-year-sampling-begins-in-2025-report</link>
                                                                            <description>
                            <![CDATA[ Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies. ]]>
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                                                                        <pubDate>Thu, 22 Aug 2024 19:39:32 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-1280-80.png">
                                                            <media:credit><![CDATA[AMD]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[AMD]]></media:description>                                                            <media:text><![CDATA[AMD]]></media:text>
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                                                            <title><![CDATA[ SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S. ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/sk-hynix-could-get-nearly-dollar1-billion-to-support-dollar387-billion-advanced-packaging-facility-in-the-us</link>
                                                                            <description>
                            <![CDATA[ SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S. ]]>
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                                                                        <pubDate>Wed, 07 Aug 2024 13:15:39 +0000</pubDate>                                                                                                                                                                                                                                <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/NFsR7zzEc8asPnVCkk2HuY-1280-80.png">
                                                            <media:credit><![CDATA[SK Hynix]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[SK Hynix]]></media:description>                                                            <media:text><![CDATA[SK Hynix]]></media:text>
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                                                            <title><![CDATA[ Ampere unveils monstrous 512-core AmpereOne Aurora processor — custom AI engine, support for HBM memory ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/cpus/ampere-unveils-monstrous-512-core-ampereone-auroa-processor-custom-ai-engine-support-for-hbm-memory</link>
                                                                            <description>
                            <![CDATA[ Ampere is adding a 512-core AmpereOne Aurora processor to its roadmap, and it also divulged pricing for its AmpereOne lineup. ]]>
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                                                                        <pubDate>Wed, 31 Jul 2024 15:00:18 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 10:12:11 +0000</updated>
                                                                                                                                            <category><![CDATA[CPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ palcorn@outlook.com (Paul Alcorn) ]]></author>                    <dc:creator><![CDATA[ Paul Alcorn ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/stP9t6QHESL9PbhrHub77Z-1280-80.png">
                                                            <media:credit><![CDATA[Ampere]]></media:credit>
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                                                            <title><![CDATA[ Preliminary HBM4 specs point to major performance uplift for GPUs — transfer speeds up to 6.4 GT/s across a 2048-bit interface ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/tech-industry/preliminary-hbm4-specs-point-to-major-performance-uplift-for-gpus</link>
                                                                            <description>
                            <![CDATA[ JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations. ]]>
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                                                                        <pubDate>Fri, 12 Jul 2024 17:39:23 +0000</pubDate>                                                                                                                                <updated>Fri, 12 Jul 2024 19:06:35 +0000</updated>
                                                                                                                                            <category><![CDATA[Tech Industry]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-1280-80.png">
                                                            <media:credit><![CDATA[AMD]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[AMD]]></media:description>                                                            <media:text><![CDATA[AMD]]></media:text>
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                                                            <title><![CDATA[ Chinese memory maker gets $2.4 billion to build HBM for AI processors — Shanghai packaging facility to open in 2026 ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/dram/chinese-memory-maker-gets-dollar24-billion-to-build-hbm-for-ai-processors-shanghai-packaging-facility-to-open-in-2026</link>
                                                                            <description>
                            <![CDATA[ CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI. ]]>
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                                                                        <pubDate>Fri, 28 Jun 2024 14:52:35 +0000</pubDate>                                                                                                                                <updated>Thu, 21 Aug 2025 12:44:26 +0000</updated>
                                                                                                                                            <category><![CDATA[DRAM]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                    <category><![CDATA[RAM]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/png" url="https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-1280-80.png">
                                                            <media:credit><![CDATA[AMD]]></media:credit>
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                                                            <title><![CDATA[ Micron to expand production of HBM3E memory across the world to increase HBM market share: Report ]]></title>
                                                                                                                                                                                                <link>https://www.tomshardware.com/pc-components/gpus/micron-to-expand-production-of-hbm3e-memory-across-the-world-to-increase-hbm-market-share-report</link>
                                                                            <description>
                            <![CDATA[ Nikkei says that Micron is set to produce more HBM3E memory in Taiwan, expand R&D operations in the U.S. and even start producing HBM3E memory in Malaysia. ]]>
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                                                                        <pubDate>Wed, 19 Jun 2024 14:12:01 +0000</pubDate>                                                                                                                                <updated>Wed, 09 Apr 2025 13:02:02 +0000</updated>
                                                                                                                                            <category><![CDATA[GPUs]]></category>
                                                    <category><![CDATA[PC Components]]></category>
                                                                                                <author><![CDATA[ ashilov@gmail.com (Anton Shilov) ]]></author>                    <dc:creator><![CDATA[ Anton Shilov ]]></dc:creator>                                                                                                    <media:content type="image/jpeg" url="https://cdn.mos.cms.futurecdn.net/i5Ndr4tjfdQGJU5Gke2rF-1280-80.jpg">
                                                            <media:credit><![CDATA[Future]]></media:credit>
                                                                                                                                                                                                                                    <media:description><![CDATA[Micron&#039;s HBM3E memory chip.]]></media:description>                                                            <media:text><![CDATA[Micron&#039;s HBM3E memory chip.]]></media:text>
                                <media:title type="plain"><![CDATA[Micron&#039;s HBM3E memory chip.]]></media:title>
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